Copper-bearing titanium alloy prepared by two-wire electron beam additive manufacturing with enhanced antibacterial activity

被引：2

作者：

Nikolaeva, A. V. ^{[1
]}

Nikonenko, A. V. ^{[1
]}

Bakina, O. V. ^{[1
]}

Chzhou, V. R. ^{[1
]}

Miller, A. A. ^{[1
]}

Rodkevich, N. G. ^{[1
]}

Zykova, A. P. ^{[1
]}

机构：

[1] Russian Acad Sci, Inst Strength Phys & Mat Sci, Siberian Branch, Tomsk 634055, Russia

来源：

MATERIALS LETTERS | 2023年 / 351卷

关键词：

Electron beam additive manufacturing; Ti6Al4V/Cu; Antibacterial effect; S.aureus; C.albicans; CELL BIOCOMPATIBILITY; CU CONTENT;

D O I：

10.1016/j.matlet.2023.135051

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Bacterial biofilms on titanium implant surfaces may lead to the development ofperi-implant diseases. For the first time, Ti6Al4V/Cu prepared by double-wire electron beam additive manufacturing (EBAM) were subjected to in -vitro antimicrobial test. The antimicrobial activity of the materials was investigated against S.aureus and C. albicans strains depending upon the amount of copper added. Increasing the copper content in material to 9.7 wt % allowed achieving 99% bacterial population reduction on the copper-containing substrate. Such an enhanced antimicrobial acivity of the substrate was caused by the release of copper ions from the Ti6Al4/Cu alloys.

引用

页数：4

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