MEMS Shielded Capacitive Pressure and Force Sensors with Excellent Thermal Stability and High Operating Temperature

被引：10

作者：

Ghanam, Muhannad ^{[1
]}

Goldschmidtboeing, Frank ^{[1
]}

Bilger, Thomas ^{[1
]}

Bucherer, Andreas ^{[1
]}

Woias, Peter ^{[1
]}

机构：

[1] Univ Freiburg, Lab Design Microsyst, IMTEK, D-79106 Freiburg, Germany

来源：

SENSORS | 2023年 / 23卷 / 09期

关键词：

capacitive pressure sensors; capacitive force sensors; high-temperature applications; temperature drift; SILICON; FABRICATION;

D O I：

10.3390/s23094248

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

In this paper, we present an innovative manufacturing process for the production of capacitive pressure and force sensors with excellent thermal stability for high-temperature applications. The sensors, which are manufactured from a stack of two silicon chips mounted via with gold-silicon (Au-Si) or aluminum-silicon (Al-Si) eutectic bonding, are shielded, miniaturized, and allow an operating temperature of up to 500 degrees C. Compared to conventional methods, the greatest benefit of the manufacturing process is that different sensor dimensions can be produced in the same batch for a wide measuring range, from mN to kN. The characterization of the realized sensors shows a high linearity and a low temperature drift of 99.992% FS and -0.001% FS/K at 350 degrees C, as well as a nonlinearity of 0.035% FS and a temperature drift of -0.0027% FS/K at 500 degrees C.

引用

页数：16

共 50 条

[11] Analytical study of temperature coefficients of bulk MEMS capacitive accelerometers operating in closed-loop mode [J].

Zhou, Wu ;

He, Jiangbo ;

Yu, Huijun ;

He, Xiaoping ;

Peng, Peng .

SENSORS AND ACTUATORS A-PHYSICAL, 2019, 290 :239-247

[12] Structural Designing of a MEMS Capacitive Accelerometer for Low Temperature Coefficient and High Linearity [J].

He, Jiangbo ;

Zhou, Wu ;

Yu, Huijun ;

He, Xiaoping ;

Peng, Peng .

SENSORS, 2018, 18 (02)

[13] A High-Performance Capacitive Force Sensor for High-Temperature Applications [J].

Ghanam, Muhannad ;

Woias, Peter ;

Goldschmidtboeing, Frank .

IEEE SENSORS LETTERS, 2025, 9 (06)

[14] Application of bulk silicon carbide technology in high temperature MEMS sensors [J].

Zhai, Yanxin ;

Li, Haiwang ;

Wu, Hanxiao ;

Tao, Zhi ;

Xu, Guoqiang ;

Cao, Xiaoda ;

Xu, Tiantong .

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2024, 173

[15] Materials and Sensing Mechanisms for High-Temperature Pressure Sensors: A Review [J].

Chen, Yankun ;

Xu, Qian ;

Zhang, Xiuqin ;

Kuang, Minxuan .

IEEE SENSORS JOURNAL, 2023, 23 (22) :26910-26924

[16] Graphene oxide as high-performance dielectric materials for capacitive pressure sensors [J].

Wan, Shu ;

Bi, Hengchang ;

Zhou, Yilong ;

Xie, Xiao ;

Su, Shi ;

Yin, Kuibo ;

Sun, Litao .

CARBON, 2017, 114 :209-216

[17] Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging [J].

Han, Xiangguang ;

Huang, Mimi ;

Wu, Zutang ;

Gao, Yi ;

Xia, Yong ;

Yang, Ping ;

Fan, Shu ;

Lu, Xuhao ;

Yang, Xiaokai ;

Liang, Lin ;

Su, Wenbi ;

Wang, Lu ;

Cui, Zeyu ;

Zhao, Yihe ;

Li, Zhikang ;

Zhao, Libo ;

Jiang, Zhuangde .

MICROSYSTEMS & NANOENGINEERING, 2023, 9 (01)

[18] Fabrication of Concentration Gradient Structures for High-Performance Capacitive Pressure Sensors by Novel Acoustic Resonance Mixing [J].

Zhan, Xiaobin ;

Ma, Hao ;

Xiang, Bowen ;

Li, Yuan ;

Liu, Yugui ;

Zhang, Ao ;

Jiang, Shulan .

IEEE SENSORS JOURNAL, 2025, 25 (02) :2284-2291

[19] Screen-printed capacitive pressure sensors with high sensitivity and accuracy on flexible substrates [J].

Albrecht, Andreas ;

Salmeron, Jose F. ;

Moreno-Cruz, Fernando ;

Becherer, Markus ;

Lugli, Paolo ;

Cheng, Gordon ;

Rivadeneyra, Almudena .

FLEXIBLE AND PRINTED ELECTRONICS, 2022, 7 (03)

[20] Graphene "microdrums" on a freestanding perforated thin membrane for high sensitivity MEMS pressure sensors [J].

Wang, Qiugu ;

Hong, Wei ;

Dong, Liang .

NANOSCALE, 2016, 8 (14) :7663-7671

← 1 2 3 4 5 →