Quarter-Micron Alignment of Chiplets via Positive Self-Aligned Structures

被引：0

作者：

Yu, Shengtao ^{[1
]}

Gaylord, Thomas K. ^{[1
]}

Bakir, Muhannad S. ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 2023年 / 35卷 / 21期

关键词：

Optical interconnections; passive alignment; chiplets arrays;

D O I：

10.1109/LPT.2023.3308058

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A simple self-aligning methodology is demonstrated for the accurate placement of chiplets on a substrate die. This approach is enabled by the registration of reflowed polymer domes both on the substrate and on the chiplet. Using flip-chip bonding, quarter-micron alignment accuracy is proposed and demonstrated on both Si and glass substrates. The vertical separation between chiplet and die is tailorable depending on the application. This methodology provides a potential building block for co-packaged optics.

引用

页码：1183 / 1185

页数：3

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