A study on the effect of fin pitch variation on the thermal performance of a bus duct conductor

The numerical results of this work provide an optimum design for a three-dimensional natural convection heat sink on the bus duct conductor's casing. The size of the fin pitch is regarded as a design variable. Using ANSYS FLUENT, a numerical model that closely resembles the experimental setup was created. The experimental data were compared to the IEC 60439-1 and IEC 60439-2 standards as a benchmark. Five potential fin pitch sizes (s1 = 1.0 mm, s2 = 1.5 mm, s3 = 2.0 mm, s4 = 3.0 mm, and s5 = 4.0 mm) were taken into consideration. It was shown that as the fin pitch gap size is reduced, the average surface temperature falls. According to the inves-tigation, conduction resistance increased while convective resistance reduced as the fin pitch gap size grew. The overall heat resistance did, however, rise. The optimal fin pitch size, s1 = 1 mm, outperformed the other fin pitches in terms of thermal performance. The current numerical analysis expects an improved knowledge of the influence of fin pitch on a bus duct conductor's thermal performance.