Recovery of Au and Pd from the etching solution of printed circuit boards by cementation, solvent extraction, reduction, and precipitation

被引:12
作者
Nguyen, Thi Nhan Hau [1 ]
Lee, Man Seung [1 ]
机构
[1] Mokpo Natl Univ, Inst Rare Met, Dept Adv Mat Sci & Engn, Chungnam 534729, South Korea
关键词
PCBs; Etching solution; Gold; Palladium; Recovery; HYDROMETALLURGICAL RECOVERY; SELECTIVE RECOVERY; WASTE; METALS; GOLD; COPPER;
D O I
10.1016/j.jiec.2023.06.011
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Printed circuit boards (PCBs) contain precious metals like Au and Pd. Therefore, it is important to recover these metals from waste PCBs. A process was developed in this work to recover pure Au powders and Pd compounds from the aqua regia etching solution of waste PCBs. Au(III) and Pd(II) were separated by cementation with Cu powder from the etching solutions containing Al(III), Cu(II), Fe(III), Na(I), Ni(II), Sn(II) and Zn(II). The Au and Pd metals present in the cemented Cu were dissolved together with Cu by the mixture of HCl and NaClO. Au(III) was separated from the leaching solution of the cemented Cu by solvent extraction with Cyanex 272. Then pure Au powders were recovered from the thiourea stripping solution by chemical reduction with hydrazine. In order to recover Pd(II) from the raffinate after extraction of Au(III), Pd(II) was oxidized to Pd(IV) by adding NaClO3 and then pure Pd compound ((NH4)2PdCl6) was recovered by precipitation with NH4Cl. Optimum conditions of these steps were obtained at room temperature. The purity of the recovered Au and Pd compound was higher than 99%.& COPY; 2023 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved.
引用
收藏
页码:214 / 223
页数:10
相关论文
共 30 条
[1]   Leaching and Adsorption of Gold from Waste Printed Circuit Boards Using Iodine-Iodide Solution and Activated Carbon [J].
Altansukh, Batnasan ;
Haga, Kazutoshi ;
Ariunbolor, Narankhuu ;
Kawamura, Shigeru ;
Shibayama, Atsushi .
ENGINEERING JOURNAL-THAILAND, 2016, 20 (04) :29-40
[2]  
Aprahamian V.H., 1995, MIN PROC EXT MET REV, V14, P143, DOI DOI 10.1080/08827509508914122
[3]   Simultaneous recovery of Ni and Cu from computer-printed circuit boards using bioleaching: Statistical evaluation and optimization [J].
Arshadi, M. ;
Mousavi, S. M. .
BIORESOURCE TECHNOLOGY, 2014, 174 :233-242
[4]  
Bard A.J., 1985, Standard potentials in aqueous solution, DOI DOI 10.1201/9780203738764
[5]   Study of multi-step hydrometallurgical methods to extract the valuable content of gold, silver and copper from waste printed circuit boards [J].
Birloaga, Ionela ;
Veglio, Francesco .
JOURNAL OF ENVIRONMENTAL CHEMICAL ENGINEERING, 2016, 4 (01) :20-29
[6]   A simple process for the recovery of palladium from wastes of printed circuit boards [J].
Bourgeois, Damien ;
Lacanau, Valentin ;
Mastretta, Regis ;
Contino-Pepin, Christiane ;
Meyer, Daniel .
HYDROMETALLURGY, 2020, 191
[7]  
Cui H., 2016, J. Adv. Chem. Eng, V6, P1, DOI 10.4172/2090- 4568.1000142
[8]   Metallurgical recovery of metals from electronic waste: A review [J].
Cui, Jirang ;
Zhang, Lifeng .
JOURNAL OF HAZARDOUS MATERIALS, 2008, 158 (2-3) :228-256
[9]   Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation [J].
Fogarasi, Szabolcs ;
Imre-Lucaci, Florica ;
Imre-Lucaci, Arpad ;
Ilea, Petru .
JOURNAL OF HAZARDOUS MATERIALS, 2014, 273 :215-221
[10]   Sequential recovery of metals from waste printed circuit boards using a zero-discharge hydrometallurgical process [J].
Gande, Vamsi Vikram ;
Vats, Shilpa ;
Bhatt, Nirav ;
Pushpavanam, S. .
CLEANER ENGINEERING AND TECHNOLOGY, 2021, 4