Holistic yield modeling, top-down loss analysis, and efficiency potential study of thin-film solar modules

被引:2
|
作者
Zinsser, Mario [1 ,2 ]
Helder, Tim [1 ,2 ]
Friedlmeier, Theresa Magorian [1 ]
Bauer, Andreas [1 ]
Kirchartz, Thomas [3 ,4 ,5 ]
Rau, Uwe [3 ]
Waechter, Rolf [6 ]
Powalla, Michael [1 ,2 ]
机构
[1] Zent Sonnenenergie & Wasserstoff Forsch Baden Wur, Meitnerstr 1, D-70563 Stuttgart, Germany
[2] Karlsruhe Inst Technol KIT, Light Technol Inst LTI, Engesserstr 13, D-76131 Karlsruhe, Germany
[3] Forschungszentrum Julich, IEK5 Photovolta, D-52425 Julich, Germany
[4] Univ Duisburg Essen, Fac Engn, Carl Benz Str 199, D-47057 Duisburg, Germany
[5] Univ Duisburg Essen, CENIDE, Carl Benz Str 199, D-47057 Duisburg, Germany
[6] NICE Solar Energy GmbH, Alfred Leikam Str 25, D-74523 Schwabisch Hall, Germany
关键词
ENERGY-CONSUMPTION; LOW-COST; CELLS; BUILDINGS; SIMULATIONS; PERFORMANCE; DEVICE; SHUNT; GAP;
D O I
10.1038/s42005-023-01164-6
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Precise modelling of solar cells devices under various conditions is essential to guide improvements in optimisation and performance of future technologies. Here, the authors present a holistic numerical model, verified with real-world data of thin-film CIGS modules, that can conduct loss analysis and predict the energy yield of thin film solar cells. A holistic simulation of a photovoltaic system requires multiple physical levels - the optoelectronic behavior of the semiconductor devices, the conduction of the generated current, and the actual operating conditions, which rarely correspond to the standard testing conditions (STC) employed in product qualification. We present a holistic simulation approach for all thin-film photovoltaic module technologies that includes a transfer-matrix method, a drift-diffusion model to account for the p-n junction, and a quasi-three-dimensional finite-element Poisson solver to consider electrical transport. The evolved digital model enables bidirectional calculation from material parameters to non-STC energy yield and vice versa, as well as accurate predictions of module behavior, time-dependent top-down loss analyses and bottom-up sensitivity analyses. Simple input data like current-voltage curves and material parameters of semiconducting and transport layers enables fitting of otherwise less-defined values. The simulation is valuable for effective optimizations, but also for revealing values for difficult-to-measure parameters.
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页数:9
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