Additive manufacturing of polyaniline blends for lightweight structures with tunable conductivity

被引：7

作者：

DiTullio, Brandon T. ^{[1
]}

Kuang, Xiao ^{[2
]}

Osterholm, Anna M. ^{[1
]}

Lang, Augustus W. ^{[3
]}

Kinlen, Patrick J. ^{[4
]}

Stingelin, Natalie ^{[3
,5
]}

Qi, H. Jerry ^{[2
]}

Reynolds, John R. ^{[1
,3
]}

机构：

[1] Georgia Inst Technol, Ctr Organ Photon & Elect, Sch Chem & Biochem, Georgia Tech Polymer Network, Atlanta, GA 30332 USA

[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA

[3] Georgia Inst Technol, Ctr Organ Photon & Elect, Sch Mat Sci & Engn, Georgia Tech Polymer Network, Atlanta, GA 30332 USA

[4] 1348 Remington Oaks Terr, Fenton, MO 63026 USA

[5] Georgia Inst Technol, Sch Chem & Biomol Engn, Atlanta, GA 30332 USA

来源：

JOURNAL OF MATERIALS CHEMISTRY C | 2023年 / 11卷 / 13期

基金：

美国国家科学基金会;

关键词：

POLYMERS; SENSORS; PROGRESS;

D O I：

10.1039/d2tc04183a

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Printable feedstocks that can produce lightweight, robust, and ductile structures with tunable and switchable conductivity are of considerable interest for numerous application spaces. Combining the specific properties of commodity thermoplastics with the unique electrical and redox properties of conducting polymers (CPs) presents new opportunities for the field of printed (bio)electronics. Here, we report on the direct ink write (DIW) printing of ink formulations based on polyaniline-dinonylnaphthalene sulfonic acid (PANI-DNNSA), which has been synthesized in bulk quantities (similar to 400 g). DNNSA imparts solubility to PANI up to 50 mg mL(-1), which allows the use of various additives to tune the rheological behavior of the inks without significantly compromising the electrical properties of the printed structures, which reach conductivities in the range of <10(-7)-10(0) S cm(-1) as a function of ink formulation and post treatment used. Fumed silica (FS) and ultra-high molecular weight polystyrene (UHMW-PS) additives are leveraged to endow printability and shape retention to inks, as well as to compare the use of traditional rheological modifiers with commodity thermoplastics on CP feedstocks for tailored DIW printing. We show that the incorporation of UHMW-PS into these ink formulations is critical for obtaining high crack resistance in printed structures. This work serves as a guide for future ink designs of CPs with commodity thermoplastics and their subsequent DIW printing to yield conductive architectures and devices for various applications.

引用

页码：4404 / 4414

页数：11