Integration of Edge-Emitting Quantum Dot Lasers With Different Waveguide Platforms Using Micro-Transfer Printing

被引:9
作者
Uzun, Ali [1 ]
Atar, Fatih Bilge [1 ]
Iadanza, Simone [2 ]
Loi, Ruggero [3 ]
Zhang, Jing [4 ]
Roelkens, Gunther [4 ]
Krestnikov, Igor [5 ]
Rimbock, Johanna [6 ]
O'Faolain, Liam [2 ]
Corbett, Brian [1 ]
机构
[1] Univ Coll Cork, Tyndall Natl Inst, Cork T12 R5CP, Ireland
[2] Munster Technol Univ, Cork T12 P928, Ireland
[3] X Celeprint Ltd, Cork T12 R5CP, Ireland
[4] Univ Ghent, Photon Res Grp, INTEC, Imec, B-9052 Ghent, Belgium
[5] Innolume GmbH, D-44263 Dortmund, Germany
[6] EV Grp E Thallner GmbH, A-4782 Florian Am Inn, Austria
基金
爱尔兰科学基金会;
关键词
Waveguide lasers; Optical waveguides; Silicon; Couplings; Silicon compounds; Quantum dot lasers; Laser modes; Silicon photonics; heterogeneous integration; data centers; Si waveguide; SiN waveguide; semiconductor laser;
D O I
10.1109/JSTQE.2023.3243943
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
O-band InAs/GaAs Quantum Dot edge-emitting lasers are integrated onto a number of waveguiding platforms using micro-transfer printing. These are deep recesses in 220 nm Si, 3 mu m Si and 300 nm SiN waveguide circuits. The processing technology to achieve release and high-yield accurate transfer of laser coupons up to 2.4 mm long and < 5 mu m thick onto the target substrates is described. At 85 mA, waveguide coupled powers of 1.0 mW and 0.95 mW are measured after out-coupling from the 220 nm SOI and 300 nm SiN waveguides, respectively while 1.7 mW total power was measured from the 3 mu m SOI waveguide.
引用
收藏
页数:10
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