DEVELOPMENT OF GLASS-SUBSTRATE-BASED MEMS MICRO-HOTPLATE WITH LOW-POWER CONSUMPTION AND TGV STRUCTURE THROUGH ANODIC BONDING AND GLASS THERMAL REFLOW

This study innovatively proposed a microfabrication method of anodic bonding and glass thermal reflow for fabricating glass-based MEMS micro-hotplates with (through glass via) TGV structure. Compared with the conventionally adopted Si-based micro-hotplate, the glass-based micro-hotplate with smaller thermal conductivity coefficient ( 1.4 W/(m*K)) leads to a lower power consumption. The glass-based micro-hotplate with insulation characteristic can directly support the micro-heater electrodes, and the conductive Si columns in TGV can replace the wire-bonder to realize the electrical interconnection with Integrated Circuit (IC). Finally, the fabricated glass-based micro-hotplates (0.196 mm(2)) can achieve a low power consumption of 80.4 mW at the target temperature of 305 degrees C.