A hybrid slot jet impingement/microchannel heat sink for cooling high-power electronic devices: A combined experimental and numerical study

Jet impingement cooling and microchannel cooling have been extensively adopted as the efficient cooling technologies in the thermal management of high-power electronics. In this research, an optimal hybrid slot jet impingement/microchannel heat sink, integrating the merits of two cooling methods, obtained from multiobjective optimization is machined and tested experimentally. By varying test conditions, the impact of inlet mass flow rate, inlet temperature and heat flux variations on the flow resistance and heat removal capacity of the optimal heat sink are investigated. Moreover, by conducting overall 3D numerical simulation, the internal flow and heat transfer behaviours of the heat sink are also investigated. By analyzing the flow field inside the heat sink, the experimental phenomena are interpreted. Comparing the relative errors between the numerical simulation and experimental measurement values under the same working conditions, it could be observed that the maximum relative error of the pressure drop is about 9.7 %, and the maximum relative error of the average temperature of the heated surface is only 0.9 %. According to the experimental results, as the heat flux is 200 W/ cm2, the inlet temperature is 293 K and the inlet mass flow rate is 28 g/s, the average temperature of the heated surface does not surpass 348 K, while the pressure drop is only 2.46 kPa. Additionally, compared with the literature results, the hybrid heat sink obtained after multi-objective optimization in this study realizes a significant enhancement in cooling capacity, while the pumping power to heating power ratio is not significantly increased.