In-plane stress analysis in a cracked functionally graded piezoelectric plane

The fracture behavior of a cracked functionally graded piezoelectric plane was investigated under in-plane mechanical and electrical loading. The electro-elastic properties of the plane exponentially varied along the y-axis. Employing the Fourier transform, stress analysis containing a Volterra edge dislocation in a functionally graded piezoelectric plane was carried out. These solutions were used to derive a system of Cauchy singular integral equations for analyzing the straight and curved cracks. Linear, arc, parabolic and sine wave-shaped cracks were evaluated. The integral equations were numerically solved using the Lobatto-Chebyshev integration formula for dislocation density functions on the crack face which were employed to calculate field intensity factors. The effects of the shaped crack, loading parameters, and non-homogeneity parameter on the stress and electric intensity factors were considered.