Regulating the valence state of lead ions in lead aluminosilicate glass to improve the passivation performance for advanced chip packaging

被引：4

作者：

Chen, Junwei ^{[1
]}

Li, Ao ^{[1
]}

Zhong, Cong ^{[1
]}

Zhang, Liangzhu ^{[1
]}

Lu, Kejun ^{[2
]}

Zeng, Huidan ^{[1
]}

机构：

[1] East China Univ Sci & Technol, Sch Mat Sci & Engn, Shanghai 200237, Peoples R China

[2] Beijing Beixu Elect Mat Co LTD, Beijing 100016, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2024年 / 651卷

基金：

中国国家自然科学基金;

关键词：

Lead aluminosilicate glasses; Interface passivation; Chip packaging; MOS structure; SILICATE-GLASSES; OPTICAL-PROPERTIES; SURFACE; RANGE; FILMS;

D O I：

10.1016/j.apsusc.2023.159208

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Eliminating surface ion contamination, increasing the reverse breakdown voltage and reducing the leakage current are extremely important for semiconductor devices. Herein, we demonstrated that regulating the valence state of lead ions in lead aluminosilicate glass can efficiently improve the performance of glass passivation technique for chip packaging. It was found that heat treatment technique can be utilized to control valence state of lead ions from +4 into +2 in 20PbO-4.8Al(2)O(3)-75.2SiO(2) (mol%) (PAS) glass powder, which induces transformation of [PbO3] units into stable glass former units of [PbO4] and generates a free state and charge compensator of Pb2+, therefore contributing to a more stable structure and discoloration of glass. As a result, the optical band gap of glass powder was enhanced from 4.1772 to 4.3184, which could significantly improve glass insulation. As a demonstration of chip packaging, PAS glass powder, after heat treatment processing into a paste for the passivation layer of metal-oxide-semiconductor (MOS) structure devices shows a tight and integrated structure and exhibits a lower fixed charge density from 3.97 x 10(10)cm(-2) to 2.73 x 10(10) cm(-2). This work provides techniques to adjust the structure of glass to enhance the passivation performance of glass for chip packaging.

引用

页数：8