Bi-philic Copper Surface Pool Boiling Heat Transfer Performance as a Function of Electrochemical Deposition Time

This study investigated the influence of the double electrodeposited copper surface thickness on pool boiling heat transfer performance. Pool boiling experiments were conducted using distilled water as the working fluid, ranging from the onset of nucleate boiling (ONB) to the critical heat flux (CHF). To create a bi-philic surface structure on the specimen, the electrodeposition process was divided into two steps, each with current densities set at 1 A/cm(2) and 0.08 A/cm(2), respectively. The specimen thickness was controlled by depositing the first hydrophilic layer for 15, 30, and 45 seconds, and the second hydrophobic layer was deposited for 2,500 seconds. The samples were named DDS15, DDS30, and DDS45 based on their hydrophilic deposition times. The modified surfaces showed improved heat transfer performance as the specimen thickness increased, with the double deposited and sintered(DDS45) specimen exhibiting a 3.6 times higher pool boiling heat transfer coefficient compared to the bare copper surface.