Guest Editorial Special section on the 2022 International Symposium on Semiconductor Manufacturing

被引:0
作者
Moriya, Tsuyoshi [1 ]
机构
[1] Tokyo Electron Ltd, Corp Innovat Div, Tokyo 1076325, Japan
关键词
Special issues and sections; Meetings; Semiconductor device manufacture;
D O I
10.1109/TSM.2023.3323254
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Since its beginning in 1992 in Japan, International Symposium on Semiconductor Manufacturing (ISSM) has provided unique opportunities to share the best practices of semiconductor manufacturing technologies for professionals. At the symposiums, semiconductor manufacturing professionals discussed the technologies developed to meet the worldwide requirements for advanced manufacturing. It is becoming crucial to re-examine semiconductor manufacturing in terms of fundamental principles to improve the performance of semiconductor devices. Moreover, utilizing artificial intelligence and machine learning technologies to improve semiconductor manufacturing have become a new challenge. These manufacturing technology challenges are showing the need for drastic revolutionary concept and stronger collaborative efforts to find solutions to the precompetitive challenges.
引用
收藏
页码:499 / 500
页数:2
相关论文
共 50 条
[1]   Special Section on the International Symposium on Semiconductor Manufacturing [J].
Otsuka, Nobuhiro ;
Uchino, Toshiyuki .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2009, 22 (04) :417-418
[2]   Guest Editorial Special section on the 2023 SEMI Advanced Semiconductor Manufacturing Conference [J].
Bickford, Jeanne Paulette ;
Cunff, Delphine Le ;
Buengener, Ralf ;
Radloff, Stefan ;
Werbaneth, Paul .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2024, 37 (03) :225-228
[3]   Guest Editorial Special section on The Hamlyn Symposium 2022—MedTech Reimagined [J].
Lo, Benny P. L. ;
Au, Kwok Wai Samuel ;
Chiu, Philip Wai Yan .
IEEE TRANSACTIONS ON MEDICAL ROBOTICS AND BIONICS, 2024, 6 (01) :2-3
[4]   Guest Editorial Special Section on the 2022 IEEE International Instrumentation and Measurement Technology Conference [J].
Rapuano, Sergio ;
Donnell, Kristen M. ;
Niewczas, Pawel .
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2023, 72
[6]   Guest Editorial Special Issue on the International Symposium on Integrated Circuits and Systems-ISICAS 2022 [J].
Li, Hai Helen .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2022, 69 (12) :4730-4730
[7]   Guest Editorial Special Issue on the IEEE International NEWCAS Conference 2022 [J].
Gosselin, Benoit ;
Fontaine, Rejean ;
Nabki, Frederic ;
Mitra, Srinjoy .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2023, 70 (09) :3436-3439
[8]   Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM) [J].
Nehrer, Bill ;
Boning, Duane ;
Bickford, Jeanne Paulette ;
Brozek, Tomasz ;
Pinto, Angelo ;
Inoue, Soichi ;
Pan, David Z. .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2025, 38 (02) :113-116
[9]   Guest Editorial IEEE 2022 BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium [J].
Greshishchev, Yuriy M. .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2023, 58 (09) :2405-2406
[10]   Guest Editorial Special Issue on the 2022 International Conference on Automation Science and Engineering [J].
Yi, Jingang ;
Li, Xiaoou .
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2024, 21 (03) :2169-2172