Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits

被引：3

作者：

Rich, Dennis ^{[1
]}

Kasperovich, Anna ^{[1
]}

Malakoutian, Mohamadali ^{[1
]}

Radway, Robert M. ^{[1
]}

Hagiwara, Shiho ^{[2
]}

Yoshikawa, Takahide ^{[2
]}

Chowdhury, Srabanti ^{[1
]}

Mitra, Subhasish ^{[3
]}

机构：

[1] Stanford Univ, Elect Engn, Stanford, CA 94305 USA

[2] Fujitsu Res, Kawasaki, Kanagawa, Japan

[3] Stanford Univ, Elect Engn & Comp Sci, Stanford, CA USA

来源：

2023 60TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, DAC | 2023年

关键词：

thermal management; 3D integrated circuits; back-end-of-line thermal conductivity; DIELECTRIC-CONSTANT; FILMS;

D O I：

10.1109/DAC56929.2023.10247815

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

引用

页数：6

共 36 条

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