Extraordinary thermal conductivity of polyvinyl alcohol composite by aligning densified carbon fiber via magnetic field

被引:22
作者
Guo, Xiaoxiao [1 ]
Cheng, Shujian [1 ]
Yan, Bo [1 ]
Li, Yile [1 ]
Zhou, Yinghui [1 ,2 ]
Cai, Weiwei [1 ,2 ]
Zhang, Yufeng [1 ,2 ]
Zhang, Xue-ao [1 ,2 ]
机构
[1] Xiamen Univ, Coll Phys Sci & Technol, Xiamen 361005, Peoples R China
[2] Xiamen Univ, Jiujiang Res Inst, Jiujiang 360404, Peoples R China
基金
中国国家自然科学基金;
关键词
polyvinyl alcohol; carbon fiber; thermal conductivity; Landau diamagnetism; magnetic field; BORON-NITRIDE NANOSHEETS; INTERFACE MATERIALS; ORIENTATION DISTRIBUTION; POLYMER-SOLUTIONS; ALIGNMENT; GRAPHENE; MESOPHASE; FILLERS; PITCH; NANOCOMPOSITES;
D O I
10.1007/s12274-022-5023-x
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Thermal interface materials (TIMs) with high through -plane thermal conductivity are urgently desired to avoid overheating of high power density electronics. Introducing and aligning fillers in polymer matrixes via magnetic field is a promising method to improve the thermal conductivity of the polymer. However, either the fillers need to be modified with magnetic particles or a strong magnetic field is needed for good alignment in high filler content. This prevents further improvement of the through-plane thermal conductivity. Herein, mesophase pitch -based carbon fibers (MPCFs) with a content as high as 76 wt.% are aligned vertically in water-soluble polyvinyl alcohol (PVA) under a low magnetic field ( similar to 0.4 T), forming a vertically aligned MPCF (VAMPCF)/PVA composite with an extraordinary through -plane thermal conductivity of 86 W/(m(.)K), which is higher than that of many alloys. In addition, both theoretical and experimental results demonstrate that the critical intensity of the magnetic field needed for good alignment of the fillers depends on their size and magnetic susceptibility. Furthermore, the water solubility of PVA makes it easy to recycle MPCFs. This study offers an inspired venue to develop excellent and eco-friendly TIMs to meet ever increasing demand in heat dissipation for electronics.
引用
收藏
页码:2572 / 2578
页数:7
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