Synthesis and characterization of a contorted hexabenzocoronene epoxy toward high thermal stability and thermal conductivity

被引:4
作者
Kang, Minsung [1 ]
Lee, Dohee [1 ]
Kim, Hyeon Woo [1 ]
Ahn, Seokhoon [1 ]
机构
[1] Korea Inst Sci & Technol, Inst Adv Composites Mat, Chudongro 92, Wanju Gun 55324, Jeollabuk Do, South Korea
关键词
epoxy; hexabenzocoronene; high thermal stability; pi-pi stacking; thermal conductivity; LIQUID-CRYSTALLINE EPOXY; BORON-NITRIDE; MECHANICAL-PROPERTIES; COMPOSITES; HYBRID; NANOPLATELETS; FILLER; RESIN; FILMS; BN;
D O I
10.1002/bkcs.12694
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
A contorted hexabenzocorone (HBC) mesogen based epoxy was synthesized and characterized for high thermal stability and thermal conductivity. Since HBC has a nano-graphene like structure, which would have strong pi-pi interactions, it was expected that HBC epoxy would have superior heat resistance and thermal conductivity. Based on this hypothesis, HBC containing four epoxy groups at edges was synthesized and confirmed by NMR and mass spectrum. HBC epoxy was cured with diaminophenolsulfone and their thermal stability and thermal conductivity were investigated. As expected, the decomposition of 5 wt% occurred at 323.44?, and thermal conductivity was 0.32 W/mK where the general thermal conductivity of epoxy resins is around 0.2 W/mK. Such enhancement of thermal properties would be explained by the formation of pi-pi stacking of HBC mesogens.
引用
收藏
页码:558 / 564
页数:7
相关论文
共 50 条
  • [1] Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications
    Hutchinson, John M.
    Roman, Frida
    Folch, Adria
    POLYMERS, 2018, 10 (03):
  • [2] Nanostructured Electrical Insulating Epoxy Thermosets with High Thermal Conductivity, High Thermal Stability, High Glass Transition Temperatures and Excellent Dielectric Properties
    Mo, Hailin
    Huang, Xingyi
    Liu, Fei
    Yang, Ke
    Li, Shengtao
    Jiang, Pingkai
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2015, 22 (02) : 906 - 915
  • [3] Recyclable Polymeric Composite with High Thermal Conductivity
    Shin, Haeun
    Kim, Chae Bin
    Ahn, Seokhoon
    Kim, Doohun
    Lim, Jong Kuk
    Goh, Munju
    COMPOSITES RESEARCH, 2019, 32 (06): : 319 - 326
  • [4] Silicone Resin-Based Composite Materials for High Thermal Stability and Thermal Conductivity
    Liu, Yi
    Chen, Zhenxing
    Qin, Yishen
    Shen, Yuqiu
    Zhou, Yong
    Wang, Dan
    Hu, Jiaxin
    Feng, Wenchao
    JOURNAL OF ELECTRONIC MATERIALS, 2020, 49 (07) : 4379 - 4384
  • [5] Preparation and characterization of epoxy-based composite with multilayered structure and high thermal conductivity
    Chen, Lu
    Xiao, Chao
    Tang, Yunlu
    Zhang, Xian
    Zheng, Kang
    Tian, Xingyou
    MATERIALS RESEARCH EXPRESS, 2019, 6 (07):
  • [6] Recent progress on thermal conductivity of graphene filled epoxy composites
    Lv, Ruicong
    Ren, Yanjuan
    Guo, Haichang
    Bai, Shulin
    NANO MATERIALS SCIENCE, 2022, 4 (03) : 205 - 219
  • [7] Advances in Liquid Crystal Epoxy: Molecular Structures, Thermal Conductivity, and Promising Applications in Thermal Management
    Zhou, Wenying
    Wang, Yun
    Kong, Fanrong
    Peng, Weiwei
    Wang, Yandong
    Yuan, Mengxue
    Han, Xiaopeng
    Liu, Xiangrong
    Li, Bo
    ENERGY & ENVIRONMENTAL MATERIALS, 2024, 7 (04)
  • [8] Development of Epoxy/BN Composites with High Thermal Conductivity and Sufficient Dielectric Breakdown Strength Part I -Sample Preparations and Thermal Conductivity
    Wang, Zengbin
    Iizuka, Tomonori
    Kozako, Masahiro
    Ohki, Yoshimichi
    Tanaka, Toshikatsu
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2011, 18 (06) : 1963 - 1972
  • [9] Characterization of the mechanical properties and thermal conductivity of epoxy-silica functionally graded materials
    AbdulRazaq, Jaafar Sh.
    Hassan, Abdul Kareem F.
    Jasim, Nuha H.
    AIMS MATERIALS SCIENCE, 2023, 10 (01) : 182 - 199
  • [10] A facile strategy for the reduction of graphene oxide and its effect on thermal conductivity of epoxy based composites
    Xie, F.
    Qi, S. H.
    Wu, D.
    EXPRESS POLYMER LETTERS, 2016, 10 (06): : 470 - 478