Numerical analysis on thermal hydraulic characteristics of mesh-type ultra-thin vapor chambers

被引:19
作者
Li, Rui [1 ]
Gan, Yunhua [1 ,5 ]
Luo, Qiliang [2 ]
Yan, Yuying [3 ]
Li, Yong [4 ]
机构
[1] South China Univ Technol, Sch Elect Power Engn, Guangzhou 510640, Peoples R China
[2] Jiangxi Naile Copper Co Ltd, Yingtan 335211, Peoples R China
[3] Univ Nottingham, Fac Engn, Fluids & Thermal Engn Res Grp, Nottingham NG7 2RD, England
[4] South China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510640, Peoples R China
[5] South China Univ Technol, Sch Elect Power Engn, Wushan Rd, Guangzhou 510640, Peoples R China
基金
中国国家自然科学基金;
关键词
Ultra -thin vapor chamber; Numerical analysis; Mesh parameter; Transient performance; MICRO HEAT PIPES; WICK GEOMETRY; PERFORMANCE; CONDUCTIVITY; FABRICATION; SPREADERS; DESIGN;
D O I
10.1016/j.applthermaleng.2023.121648
中图分类号
O414.1 [热力学];
学科分类号
摘要
The mesh-type ultra-thin vapor chamber (UTVC) is a highly cost-effective device that spreads heat efficiently and maintains good temperature uniformity, meeting the present trend and demand for compact system heat dissipation. To analyze the thermal behavior of the mesh-type UTVC, a three-dimensional transient numerical model involving the non-isothermal flow and phase change processes of the working medium was developed to solve the hydraulic and heat transfer performance of the mesh-type UTVC. The model was validated by experimental results with a maximum relative error of 1.98 %. The effects of the mesh parameter including the support coarse mesh and the fine mesh wick on the heat transfer performance of the mesh-type UTVC are analyzed, and the thickness of the fine mesh wick is determined to be the influencing factor of the thermal response performance of the UTVC. With the design of limited space, the wick space ratio of the UTVC is reduced from 0.565 % to 0.085 %, and the thermal response time can be reduced by 22.7 %, while it is beneficial to improve the heat transfer performance of the mesh-type UTVC.
引用
收藏
页数:15
相关论文
共 39 条
[1]   Effect of design and operating parameters on the thermal performance of aluminum flat grooved heat pipes [J].
Alijani, Hossein ;
Cetin, Barbaros ;
Akkus, Yigit ;
Dursunkaya, Zafer .
APPLIED THERMAL ENGINEERING, 2018, 132 :174-187
[2]   CFD analysis of hotspots copper metal foam flat heat pipe for electronic cooling applications [J].
Brahim, Taoufik ;
Jemni, Abdelmajid .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2021, 159
[3]   The effective thermal conductivity of wire screen [J].
Chen Li ;
Peterson, G. P. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2006, 49 (21-22) :4095-4105
[4]   Optimization of vapor-liquid channel parameters for ultrathin heat pipe with limited internal cavity [J].
Chen, Zhaoshu ;
Li, Yong ;
Zhang, Ruohan ;
Xin, Zhifeng ;
Yu, Jiu ;
Deng, Liqiang ;
Yi, Wenbin .
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2023, 142
[5]   Fabrication and characterization of ultra-thin vapour chambers with printed copper powder wick [J].
Chen, Zhaoshu ;
Li, Yong ;
Yu, Jiu ;
Deng, Liqiang ;
Chen, Hanyin ;
Tang, Xinkai .
APPLIED THERMAL ENGINEERING, 2022, 201
[6]   Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices [J].
Chen, Zhaoshu ;
Li, Yong ;
Zhou, Wenjie ;
Deng, Liqiang ;
Yan, Yuying .
ENERGY CONVERSION AND MANAGEMENT, 2019, 187 :221-231
[7]   Transient analysis of heat transfer and fluid flow in a polymer-based Micro Flat Heat Pipe with hybrid wicks [J].
Famouri, Mehdi ;
Carbajal, Gerardo ;
Li, Chen .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2014, 70 :545-555
[8]   A new ultra-thin vapor chamber with composite wick for thin electronic products [J].
Huang, Guangwen ;
Liu, Wangyu ;
Luo, Yuanqiang ;
Li, Yong ;
Chen, Hanyin .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2021, 170
[9]   Fabrication and capillary performance of a novel composite wick for ultra-thin heat pipes [J].
Huang Guangwen ;
Liu Wangyu ;
Luo Yuanqiang ;
Li Yong ;
Chen Hanyin .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2021, 176
[10]   A novel ultra-thin vapor chamber for heat dissipation in ultra-thin portable electronic devices [J].
Huang, Guangwen ;
Liu, Wangyu ;
Luo, Yuanqiang ;
Li, Yong .
APPLIED THERMAL ENGINEERING, 2020, 167