Two-dimensional multichannel bandpass filter bank with improved fractional bandwidth and selectivity

被引:4
作者
Aidoo, Michael W. [1 ]
Song, Kaijun [1 ,2 ]
Zhou, Yedi [1 ]
Fan, Yong [1 ]
机构
[1] Univ Elect Sci & Technol China, EHF Key Lab Sci, Chengdu, Peoples R China
[2] Univ Elect Sci & Technol China, Sch Elect Sci & Engn, EHF Key Lab Sci, Chengdu 611731, Peoples R China
基金
中国国家自然科学基金;
关键词
bandpass filter bank; bandwidth; multichannel; substrate integrated waveguide (SIW); transmission zero (TZ); POWER DIVIDER; CROSSOVERS; SIW;
D O I
10.1002/mop.33789
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter presents a six-channel bandpass filter bank created on substrate integrated waveguide (SIW) with improved bandwidth and frequency selectivity on the lower band. Through SIW square cavities and slant slots, a two-dimensional multichannel bandpass filter bank with a transmission zero constructed with the SIW orthogonal resonant modes is produced. The substrate integrated square cavity approach is used to achieve the propagation of the two orthogonal-oriented transverse electric modes, TE102 and TE201, which resonate on the same frequency and bandwidth, depending on the location of the feed ports. The bandwidth could be altered by the coupling matrix synthesis and coupling windows. Better transmission and bandpass responses are produced in each channel when the feed ports and coupling gaps are positioned and appropriately adjusted. However, a pair of slot lines are imprinted along each cavity's designated diagonal to guarantee better isolation while attaining an increased fractional bandwidth. A 3 x 3 array of six bandpass filters with a center frequency of 8.65 GHz has been built, simulated, and measured to establish the suggested technique. Low insertion loss, high return loss, high isolation, an improved fractional bandwidth, and a compact device were the proposal's advantages.
引用
收藏
页码:2756 / 2762
页数:7
相关论文
共 26 条
  • [1] Ahmed BA., 2020, 2020 IEEE MTT S LAT, V2, P25, DOI [10.1109/LAMC50424.2021.9602392, DOI 10.1109/LAMC50424.2021.9602392]
  • [2] Single- and Dual-Band Bandpass Filters Using a Single Perturbed SIW Circular Cavity
    Azad, Amit Ranjan
    Mohan, Akhilesh
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2019, 29 (03) : 201 - 203
  • [3] Cameron R. J., 2018, Microwave Filters for Communication Systems: Fundamentals Design and Applications
  • [4] Advanced coupling matrix synthesis techniques for microwave filters
    Cameron, RJ
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (01) : 1 - 10
  • [5] Single-Layer Dual-Band Balanced Substrate- Integrated Waveguide Filtering Power Divider for 5G Millimeter-Wave Applications
    Chi, Pei-Ling
    Chen, Yi-Ming
    Yang, Tao
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2020, 30 (06) : 585 - 588
  • [6] Substrate Integrated Waveguide Filter With Flexible Mixed Coupling
    Chu, Peng
    Zhu, Peng
    Feng, Jianguo
    Guo, Lei
    Zhang, Long
    Zhu, Fang
    Liu, Leilei
    Luo, Guo Qing
    Wu, Ke
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2023, 71 (09) : 4003 - 4011
  • [7] Novel Substrate Integrated Waveguide Filtering Crossover Using Orthogonal Degenerate Modes
    Han, Si-Qi
    Zhou, Kang
    Zhang, Jin-Dong
    Zhou, Chun-Xia
    Wu, Wen
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2017, 27 (09) : 803 - 805
  • [8] Hong J.-S., 2011, Microstrip filters for RF microwave applications, V2nd, DOI [10.1002/9780470937297, DOI 10.1002/9780470937297]
  • [9] A compact self-packaged triple-mode bandpass filter using dual capacitively-loaded substrate-integrated waveguide resonator
    Jing, Huaishu
    Zhang, Yonghong
    Qu, Lili
    Jing, Shouzhao
    Liu, Jiawei
    Bo, Xiaole
    [J]. MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2022, 64 (06) : 992 - 997
  • [10] Millimeter-wave substrate integrated waveguide bandpass filters based on stepped-impedance E-shaped defected ground structures
    Li, Jian
    Zheng, Wenxian
    Wei, Xueming
    Huang, Yongjun
    Wen, Guangjun
    [J]. INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, 2022, 32 (11)