Characterization of Octyl Hydroxamic Acid as Inhibitor on Cu Chemical Mechanical Polishing

被引：3
|
作者：
Xia, Rongyang [1 ,2 ]
Hu, Lianjun [3 ]
Cao, Jingwei [1 ,2 ]
Pan, Guofeng [1 ,2 ]
Qi, Yuhang [1 ,2 ]
机构：
[1] Hebei Univ Technol, Sch Elect & Informat Engn, Tianjin, Peoples R China
[2] Tianjin Key Lab Elect Mat & Devices, Tianjin 300130, Peoples R China
[3] Tianjin Univ Commerce, Tianjin 300134, Peoples R China
来源：
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | 2023年 / 12卷 / 05期
关键词：
Inhibitor; Chemical Mechanical Planarization; Density Functional Theory; DENSITY-FUNCTIONAL THEORY; CORROSION INHIBITION; COPPER CORROSION; LEAVES EXTRACT; ADSORPTION; CMP; DERIVATIVES; OXIDATION; CU(111); STEEL;
D O I：
10.1149/2162-8777/acd722
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
As an inhibitor for copper (Cu), Octyl hydroxamic acid (OHA) has been extensively studied through a combination of density functional theory (DFT) and experiments. Our findings indicate that using a concentration of 3 mM OHA as an inhibitor can lead to a remarkable removal rate (RR) and surface quality when the pH is at 10. Tafel analysis of potentiodynamic polarization plots was performed to demonstrate that OHA can lower the corrosion current. Further insight into the adsorption behavior of OHA on the Cu surface was obtained through a comprehensive study combining X-ray photoelectron spectroscopy (XPS), DFT calculations, and adsorption isotherm model analysis.
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页数：8
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