Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment

被引：3

作者：

Zhao, Jun-Ren ^{[1
]}

Hung, Fei-Yi ^{[1
]}

Hsu, Che-Wei ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

MATERIALS | 2023年 / 16卷 / 03期

关键词：

silver wire; wire bonding; chloride ions; ion migration; galvanic corrosion; ELECTRICAL-PROPERTIES; COPPER WIRE; CU WIRE; AG WIRE; MICROSTRUCTURE; RELIABILITY; CHLORINATION; TENSILE; GOLD;

D O I：

10.3390/ma16031066

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Chloride ions contained in the sealing compound currently used in the electronic packaging industry not only interact with intermetallic compounds but also have a serious impact on silver alloy wires. A 15 mu m ultrafine quaternary silver-palladium-gold-platinum alloy wire was used in this study. The wire and its bonding were immersed in a 60 degrees C saturated sodium chloride solution (chlorination experiment), and the strength and elongation before and after chlorination were measured. Finally, the fracture surface and cross-section characteristics were observed using a scanning electron microscope and focused ion microscope. The results revealed that chloride ions invade the wire along the grain boundary, and chlorides have been generated inside the cracks to weaken the strength and elongation of the wire. In addition, chloride ions invade the interface of the wire bonding to erode the aluminum substrate after immersing it for enough long time, causing galvanic corrosion, which in turn causes the bonding joint to separate from the aluminum substrate.

引用

页数：12