共 50 条
- [43] Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 685 - 692
- [44] Dielectric Characteristics of Polymer and Ceramic Based 3d Printing Materials for Various Manufacturing Defects 2023 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, CEIDP, 2023,
- [46] Additive Manufacturing with 3D Printing: Progress from Bench to Bedside AAPS JOURNAL, 2018, 20 (06):
- [49] 3D Ceramic Microfluidic Device Manufacturing INTERNATIONAL MEMS CONFERENCE 2006, 2006, 34 : 533 - 539