Millimeter Wave Thin-Film Bulk Acoustic Resonator in Sputtered Scandium Aluminum Nitride

被引:20
作者
Cho, Sinwoo [1 ]
Barrera, Omar [1 ]
Simeoni, Pietro [2 ]
Marshall, Emily N. [3 ]
Kramer, Jack [1 ]
Motoki, Keisuke [3 ]
Hsu, Tzu-Hsuan [1 ,4 ]
Chulukhadze, Vakhtang [1 ]
Rinaldi, Matteo [2 ]
Doolittle, W. Alan [3 ]
Lu, Ruochen [1 ]
机构
[1] Univ Texas Austin, Dept Elect & Comp Engn, Austin, TX 78712 USA
[2] Northeastern Univ, Dept Elect & Comp Engn, Boston, MA 02115 USA
[3] Georgia Inst Technol, Dept Elect & Comp Engn, Atlanta, GA 30332 USA
[4] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 30013, Taiwan
关键词
Millimeter wave communication; Film bulk acoustic resonators; Acoustics; Films; Electrodes; Performance evaluation; Aluminum nitride; Acoustic resonators; piezoelectric devices; scandium aluminum nitride (ScAlN); millimeter-wave devices; thin-film bulk acoustic resonator (FBAR); thin-film devices;
D O I
10.1109/JMEMS.2023.3321284
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work reports a millimeter wave (mmWave) thin-film bulk acoustic resonator (FBAR) in sputtered scandium aluminum nitride (ScAlN). This paper identifies challenges of frequency scaling sputtered ScAlN into mmWave and proposes a stack and new fabrication procedure with a sputtered Sc-0.3 Al-0.7 N on Al on Si carrier wafer. The resonator achieves electromechanical coupling ( k(2) ) of 7.0% and quality factor ( Q ) of 62 for the first-order symmetric (S1) mode at 21.4 GHz, along with k(2) of 4.0% and Q of 19 for the third-order symmetric (S3) mode at 55.4 GHz, showing higher figures of merit (FoM, k(2)& sdot;Q ) than reported AlN/ScAlN-based mmWave acoustic resonators. The ScAlN quality is identified by transmission electron microscopy (TEM) and X-ray diffraction (XRD), identifying the bottlenecks in the existing piezoelectric-metal stack. Further improvement of ScAlN/AlN-based mmWave acoustic resonators calls for better crystalline quality from improved thin-film deposition methods. [2023-0151]
引用
收藏
页码:529 / 532
页数:4
相关论文
共 24 条
[1]  
Barrera O., 2023, ARXIV
[2]  
Cho Sinwoo, 2023, 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS), P1, DOI 10.1109/EFTF/IFCS57587.2023.10272186
[3]   Al0.68Sc0.32N Lamb wave resonators with electromechanical coupling coefficients near 10.28% [J].
Esteves, Giovanni ;
Young, Travis R. ;
Tang, Zichen ;
Yen, Sean ;
Bauer, Todd M. ;
Henry, Michael D. ;
Olsson, Roy H., III .
APPLIED PHYSICS LETTERS, 2021, 118 (17)
[4]   After 60 Years: A New Formula for Computing Quality Factor is Warranted [J].
Feld, David A. ;
Parker, Reed ;
Ruby, Richard S. M. ;
Bradley, Paul S. M. ;
Dong, Shim .
2008 IEEE ULTRASONICS SYMPOSIUM, VOLS 1-4 AND APPENDIX, 2008, :431-+
[5]   Microwave Acoustic Devices: Recent Advances and Outlook [J].
Gong, Songbin ;
Lu, Ruochen ;
Yang, Yansong ;
Gao, Liuqing ;
Hassanien, Ahmed E. .
IEEE JOURNAL OF MICROWAVES, 2021, 1 (02) :601-609
[6]   From Microwave Acoustic Filters to Millimeter-Wave Operation and New Applications [J].
Hagelauer, Amelie ;
Ruby, Rich ;
Inoue, Shogo ;
Plessky, Victor ;
Hashimoto, Ken-Ya ;
Nakagawa, Ryo ;
Verdu, Jordi ;
De Paco, Pedro ;
Mortazawi, Amir ;
Piazza, Gianluca ;
Schaffer, Zachary ;
Yen, Ernest Ting-Ta ;
Forster, Thomas ;
Tag, Andreas .
IEEE JOURNAL OF MICROWAVES, 2023, 3 (01) :484-508
[7]  
Hara Motoaki, 2009, 2009 IEEE International Ultrasonics Symposium, P851, DOI 10.1109/ULTSYM.2009.5441576
[8]   A K-Band Bulk Acoustic Wave Resonator Using Periodically Poled Al0.72Sc0.28N [J].
Izhar, Merrilyn M. A. ;
Fiagbenu, Merrilyn M. A. ;
Musavigharavi, Pariasadat ;
Du, Xingyu ;
Leathersich, Jeff ;
Moe, Craig ;
Kochhar, Abhay A. ;
Stach, Eric A. ;
Vetury, Ramakrishna H. ;
Olsson, Roy H. .
IEEE ELECTRON DEVICE LETTERS, 2023, 44 (07) :1196-1199
[9]  
Kramer J., 2023, P JOINT C EUR FREQ T, P1
[10]   57 GHz Acoustic Resonator with k2 of 7.3% and Q of 56 in Thin-Film Lithium Niobate [J].
Kramer, Jack ;
Cho, Sinwoo ;
Liao, Michael E. ;
Huynh, Kenny ;
Barrera, Omar ;
Matto, Lezli ;
Goorsky, Mark S. ;
Lu, Ruochen .
2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM, 2022,