Thermal and Mechanical Properties of Nano Silicon Carbide/Epoxy Composites by Surface Modification Using Oleic Acid, Imidazole, and Epoxy Silane

被引：1
作者：
Sung, Kyung-Soo [1 ]
Jang, Hyerin [2 ]
Kim, Namil [2 ]
机构：
[1] Protavic Korea, Res & Dev Ctr, Daejeon 34326, South Korea
[2] Hannam Univ, Dept Chem Engn, Daejeon 34054, South Korea
来源：
POLYMER-KOREA | 2023年 / 47卷 / 06期
关键词：
silicon carbide; thermal interface materials; thermal conductivity; tensile strength; die shear strength; BORON-NITRIDE; CONDUCTIVITY; BN;
D O I：
10.7317/pk.2023.47.6.786
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
The surface of nano-sized silicon carbide (SiC) was modified using oleic acid, imidazole, and silane coupling agents, and then the effect of surface modification on the thermal and mechanical properties of epoxy/SiC composites was investigated. At the same SiC content, the viscosity of epoxy solution was lowered noticeably by surface modifi-cation, while the adhesive strength, storage modulus, and tensile strength increased. From the thermogravimetric analysis (TGA) thermograms, the silane coupling agent was found to be stable at high temperature above 400 celcius, but oleic acid and imidazole showed the weight loss at around 200 celcius, which subsequently affecting the adhesive strength at high tem-perature. The thermal conductivity of composites containing surface-modified SiC was slightly lower than that of the untreated SiC composites.
引用
收藏
页码：786 / 792
页数：7
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