Evidence of silicide at the Ni/?-Si3N4(0001)/Si(111) interface

被引:2
作者
Rajak, Piu [1 ,2 ]
Ciancio, Regina [1 ,3 ]
Caretta, Antonio [4 ]
Laterza, Simone [4 ,5 ]
Bhardwaj, Richa [4 ]
Jugovac, Matteo [6 ]
Malvestuto, Marco [1 ,4 ]
Moras, Paolo [6 ]
Flammini, Roberto [7 ]
机构
[1] Consiglio Nazl Ric Ist Officina Materiali, CNR IOM, Trieste, Italy
[2] Abdus Salam Int Ctr Theoret Phys, Via Beirut,6, I-34151 Trieste, Italy
[3] Area Sci Pk Basovizza SS, 14 Km 163-5, I-34149 Trieste, Italy
[4] Elettra Sincrotrone Trieste SCPA, Via A Valerio 2, I-34149 Trieste, Italy
[5] Univ Trieste, Dept Phys, Via A Valerio 2, I-34127 Trieste, Italy
[6] Consiglio Nazl Ric Ist Struttura Mat, CNR ISM, SS 14 km 163-5, I-34149 Trieste, Italy
[7] Consiglio Nazl Ric Ist Struttura Mat, CNR ISM, Via Fosso Cavaliere 100, I-00133 Rome, Italy
基金
欧盟地平线“2020”;
关键词
silicon nitride; Silicide; Metal; silicon interface; HRTEM; HAADF-STEM; EDS; THERMAL-EXPANSION; EPITAXIAL NISI2; NI; GROWTH; SURFACE; SI; MICROSCOPY; DIFFUSION; NITRIDE; SI(111);
D O I
10.1016/j.apsusc.2023.156986
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We present a study of a sub-nanometre interlayer of crystalline silicon nitride at the Ni/Si interface. We performed transmission electron microscopy measurements complemented by energy dispersive X-ray analysis to investigate to what extent the nitride layer act as a barrier against atom diffusion. The results show that discontinuous silicide areas can form just below the nitride layer, whose composition is compatible with that of the nickel disilicide. The Ni-Si reaction is tentatively attributed to the thermal strain suffered by the interface during the deposition of Ni at low temperature.
引用
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页数:8
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