Promoting Dynamic Recrystallization of Al-Zn-Mg-Cu Alloy via Electroshock Treatment

被引:4
作者
Song, Yanli [1 ,2 ,3 ,4 ]
Wu, Yuhang [1 ]
Lu, Jue [1 ,2 ,3 ]
Mei, Manlin [1 ]
Xie, Lechun [1 ,2 ,3 ,4 ]
Hao, Chuanchuan [1 ]
机构
[1] Wuhan Univ Technol, Hubei Key Lab Adv Technol Automot Components, Wuhan 430070, Peoples R China
[2] Wuhan Univ Technol, Hubei Collaborat Innovat Ctr Automot Components Te, Wuhan 430070, Peoples R China
[3] Wuhan Univ Technol, Hubei Res Ctr New Energy & Intelligent Connected V, Wuhan 430070, Peoples R China
[4] Wuhan Univ Technol, Hubei Engn Res Ctr Green Precis Mat Forming, Wuhan 430070, Peoples R China
基金
中国国家自然科学基金; 国家重点研发计划;
关键词
Al-Zn-Mg-Cu alloy; electroshock treatment; dynamic recrystallization; dislocation; grain boundary; ELECTRIC-CURRENT; MG-3AL-1ZN ALLOY; DEFORMATION; MICROSTRUCTURE; TEXTURE;
D O I
10.3390/met13050944
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The application of high-strength Al-Zn-Mg-Cu alloy is seriously limited because of its poor formability. A novel electroshock treatment (EST) technique with low frequency combined with tensile deformation was proposed to address the issues of low plasticity and poor formability of Al-Zn-Mg-Cu alloy, which could revolutionize conventional plastic forming methods and realize near-room temperature forming of complex components. Al-Zn-Mg-Cu alloy was examined in this work to figure out how EST affects the tensile characteristics and dynamic recrystallization of the alloy during tensile deformation. The findings demonstrate that when electroshock with a current density of 30 A/mm(2) and a period of 5 s, the elongation of the alloy increased by 21.74%, and the fraction of dynamic recrystallization increased by 77.56% compared to the sample without EST at a temperature far below the recrystallization temperature. The electron back scatter diffraction (ESBD) results show that after appropriate EST, the average grain size decreased from 40 mu m to 30 mu m, the distribution of grain was more uniform, and the sample's grain boundary angle generally increased, which is more attractive to facilitate the nucleation and growth of dynamic recrystallization. Additionally, transmission electron microscopy (TEM) results indicate that electroshock energy motivated the migration of dislocations from the grain interior to near the grain boundaries, improving the ability of Al-Zn-Mg-Cu alloy to dynamically recrystallize at near ambient temperature and enhancing elongation.
引用
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页数:14
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