Twisted Bilayer Graphene: A Journey Through Recent Advances and Future Perspectives

被引:2
作者
Rakkesh, R. Ajay [1 ]
Rebecca, P. N. Blessy [1 ]
Naveen, T. B. [1 ]
Durgalakshmi, D. [2 ]
Balakumar, S. [3 ]
机构
[1] SRM Inst Sci & Technol, Fac Engn & Technol, Dept Phys & Nanotechnol, Funct Nanomat FuN Lab, Kattankulathur 603203, Tamil Nadu, India
[2] Anna Univ, Dept Med Phys, Chennai 600025, Tamil Nadu, India
[3] Univ Madras, Natl Ctr Nanosci & Nanotechnol, Chennai 600025, Tamil Nadu, India
关键词
2D nanostructures; electronic properties; material science; twisted bilayer graphene; CHEMICAL-VAPOR-DEPOSITION; VAN-HOVE SINGULARITIES; HIGH-QUALITY; LARGE-AREA; CORRELATED STATES; FLAT-BAND; ANGLE; MOIRE; SUPERCONDUCTIVITY; GROWTH;
D O I
10.1002/ppsc.202300125
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Twisted bilayer graphene (TBG) has emerged as a fascinating research frontier in condensed matter physics and materials science. This review article comprehensively overviews recent advances and future perspectives in studying TBG. The challenges associated with fabricating and characterizing TBG structures, including precise control of the twist angle and accurate determination of electronic properties, are discussed. Furthermore, the intriguing phenomena observed in TBG, such as superconductivity, insulating phases, and correlated electron states, shedding light on their underlying mechanisms, are explored. Scalability and device integration of TBG are explored, along with potential engineering strategies to tailor its properties for specific applications. By synthesizing and analyzing the latest scientific reports, a roadmap for further research is provided and the promising prospects for TBG are highlighted. Twisted bilayer graphene (TBG) is an exciting frontier in condensed matter physics and materials science. This review article presents recent advances and future perspectives, addressing challenges in fabrication and characterization. Intriguing phenomena like superconductivity and insulating phases are explored, offering insights into underlying mechanisms. Scalability, device integration, and engineering strategies are discussed, providing a roadmap for future research and highlighting promising applications.image
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页数:18
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