Three-dimensional numerical investigation of flow and heat transfer performances of novel straight microchannel heat sinks

Four-type novel single crystal diamond (SCD) straight microchannel heat sinks with different shapes (symmetrically inclined, turned symmetrically inclined, V-shaped, and X-shaped) are designed and investigated by the three-dimensional computational fluid dynamics method. These four-type microchannel heat sinks are evaluated in terms of fluid flow and heat transfer capabilities compared to the conventional rectangular straight micro-channel (RSMC) heat sink. Our research indicates that the newly designed novel SCD microchannel heat sinks can enhance the heat dissipation effect in comparison to the conventional RSMC heat sink, thereby substantiating its potential for enhancing thermal management in electronic devices. Each V-shaped and X-shaped straight microchannel heat sink has a higher heat transfer capacity than the RSMC heat sink. Among the heat sinks involved in this work, the V-shaped SCD heat sink has the best surface temperature uniformity. The symmetrically inclined heat sink shows the lowest pumping power, with 14.1 % lower than that of the RSMC heat sink. The X-shaped SCD heat sink exhibits a significantly lower thermal resistance, with an 8.5 % reduction compared to the RSMC heat sink. Additionally, it demonstrates a substantially higher Nusselt number, with a 27.6 % increase relative to the RSMC heat sink. The X-shaped SCD heat sink has the highest heat transfer coefficient of up to 1.08 x 10(5) W/(m(2)center dot K), which is 20.4 % higher than that of RSMC heat sink. Owing to the highest performance evaluation criterion of 1.22, the X-shaped straight microchannel heat sink is the most optimal of the designed heat sinks.