Reversible total ionizing dose effects in NiO/Ga2O3 heterojunction rectifiers

被引:10
作者
Li, Jian-Sian [1 ]
Chiang, Chao-Ching [1 ]
Xia, Xinyi [1 ]
Stepanoff, Sergei [2 ]
Haque, Aman [3 ]
Wolfe, Douglas E. [2 ]
Ren, Fan [1 ]
Pearton, S. J. [4 ]
机构
[1] Univ Florida, Dept Chem Engn, Gainesville, FL 32606 USA
[2] Penn State Univ, Dept Mat Sci & Engn, University Pk, PA 16802 USA
[3] Penn State Univ, Dept Mech Engn, University Pk, PA 16802 USA
[4] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32606 USA
基金
美国国家科学基金会;
关键词
RADIATION; INTERFACE; DIODES; DAMAGE; IRRADIATION; TRANSPORT; HYDROGEN; MERIT;
D O I
10.1063/5.0134823
中图分类号
O59 [应用物理学];
学科分类号
摘要
NiO/Ga2O3 heterojunction rectifiers were exposed to 1 Mrad fluences of Co-60 gamma-rays either with or without reverse biases. While there is a small component of Compton electrons (600 keV), generated via the interaction of 1.17 and 1.33 MeV gamma photons with the semiconductor, which in turn can lead to displacement damage, most of the energy is lost to ionization. The effect of the exposure to radiation is a 1000x reduction in forward current and a 100x increase in reverse current in the rectifiers, which is independent of whether the devices were biased during this step. The on-off ratio is also reduced by almost five orders of magnitude. There is a slight reduction in carrier concentration in the Ga2O3 drift region, with an effective carrier removal rate of < 4 cm(-1). The changes in electrical characteristics are reversible by application of short forward current pulses during repeated measurement of the current-voltage characteristics at room temperature. There are no permanent total ionizing dose effects present in the rectifiers to 1 Mad fluences, which along with their resistance to displacement damage effects indicate that these devices may be well-suited to harsh terrestrial and space radiation applications if appropriate bias sequences are implemented to reverse the radiation-induced changes.
引用
收藏
页数:6
相关论文
共 53 条
[1]   Gate Damages Induced in SiC Power MOSFETs During Heavy-Ion Irradiation-Part I [J].
Abbate, C. ;
Busatto, G. ;
Tedesco, D. ;
Sanseverino, A. ;
Silvestrin, L. ;
Velardi, Francesco ;
Wyss, J. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (10) :4235-4242
[2]  
[Anonymous], 2016, EUROPEAN SPACE COMPO
[3]  
Baumann R., 2013, RAD HDB ELECT
[4]   Gamma non-ionizing energy loss: Comparison with the damage factor in silicon devices [J].
El Allam, E. ;
Inguimbert, C. ;
Meulenberg, A. ;
Jorio, A. ;
Zorkani, I. .
JOURNAL OF APPLIED PHYSICS, 2018, 123 (09)
[5]  
Evans R., 1955, ATOMIC NUCL
[6]   Worst-case bias during total dose irradiation of SOI transistors [J].
Ferlet-Cavrois, V ;
Colladant, T ;
Paillet, P ;
Leray, JL ;
Musseau, O ;
Schwank, JR ;
Shaneyfelt, MR ;
Pelloie, JL ;
de Poncharra, JD .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2000, 47 (06) :2183-2188
[7]   Radiation Effects in a Post-Moore World [J].
Fleetwood, Daniel M. .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2021, 68 (05) :509-545
[8]   Total Ionizing Dose Effects in MOS and Low-Dose-Rate-Sensitive Linear-Bipolar Devices [J].
Fleetwood, Daniel M. .
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2013, 60 (03) :1706-1730
[9]   Effects of hydrogen transport and reactions on microelectronics radiation response and reliability [J].
Fleetwood, DM .
MICROELECTRONICS RELIABILITY, 2002, 42 (4-5) :523-541
[10]   β-Ga2O3 vertical heterojunction barrier Schottky diodes terminated with p-NiO field limiting rings [J].
Gong, H. H. ;
Yu, X. X. ;
Xu, Y. ;
Chen, X. H. ;
Kuang, Y. ;
Lv, Y. J. ;
Yang, Y. ;
Ren, F-F ;
Feng, Z. H. ;
Gu, S. L. ;
Zheng, Y. D. ;
Zhang, R. ;
Ye, J. D. .
APPLIED PHYSICS LETTERS, 2021, 118 (20)