Electric field-induced orientation of silicon carbide whiskers for directional and localized thermal management

Incorporating high thermal conductivity fillers into the matrix material and optimizing their distribution offers a targeted approach to controlling heat flow conduction. However, the design of composite microstructure, particularly the precise orientation of fillers in the micro-nano domain, remains a formidable challenge to date. Here, we report a novel method for constructing directional/localized thermal conduction pathways based on silicon carbide whiskers (SiCWs) in the polyacrylamide (PAM) gel matrix using micro-structured electrodes. SiCWs are one-dimensional nanomaterials with ultra-high thermal conductivity, strength, and hardness. The outstanding properties of SiCWs can be maximized through ordered orientation. Under the conditions of 18 V voltage and 5 MHz frequency, SiCWs can achieve complete orientation in only about 3 s. In addition, the prepared SiCWs/PAM composite exhibits interesting properties, including enhanced thermal conductivity and localized conduction of heat flow. When the SiCWs concentration is 0.5 g & BULL;L-1, the thermal conductivity of SiCWs/PAM composite is about 0.7 W & BULL;m- 1 & BULL;K-1, which is 0.3 W & BULL;m- 1 & BULL;K-1 higher than that of PAM gel. This work achieved structural modulation of the thermal conductivity by constructing a specific spatial distribution of SiCWs units in the micro-nanoscale domain. The resulting SiCWs/PAM composite has unique localized heat conduction properties and is expected to become a new generation of composites with better characteristics and functions in thermal transmission and thermal management.