Fabrication of High Thermal Conductivity Tungsten-Coated Diamond/Tungsten Composites by a Rapid Sintering Method

被引:2
|
作者
Wei, Chenlong [1 ,2 ]
Wang, Qiang [1 ]
Dong, Zhaoshi [1 ]
Wen, Jun [1 ]
机构
[1] Anqing Normal Univ, Sch Elect Engn & Intelligent Mfg, Anqing 246133, Peoples R China
[2] Engn Res Ctr Power Met Anhui Prov, Hefei 230009, Peoples R China
基金
中国国家自然科学基金;
关键词
diamond; tungsten; interfacial bonding; thermal conductivity; tungsten-coated; DIAMOND; INFILTRATION; MANAGEMENT;
D O I
10.1007/s11665-023-07987-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
To improve heat transfer in the high heat flux devices, uncoated and tungsten-coated diamond/tungsten composites were prepared by spark plasma sintering (SPS) method. The composition and microstructure of the composites were studied by x-ray diffraction, scanning electron microscopy, and transmission electron microscopy. The results show that uncoated and tungsten-coated diamond/tungsten composites can be prepared by SPS at 1600 degrees C for 3 min and diamond can stably exist in the tungsten-based material, while diamond was destroyed in diamond/tungsten composites after conventional sintering at 1600 degrees C for 120 min. Compared with the interface gap in some areas between uncoated diamond and tungsten, tungsten-coated diamond/tungsten composites can obtain tight interfacial bonding between tungsten-coated diamond and tungsten. The highest thermal conductivity of the tungsten-coated diamond/tungsten composites prepared by SPS was 207 W/(m K), which was nearly 20% higher than the thermal conductivity of pure tungsten (174 W/(m center dot K)), indicating that adding a certain amount of tungsten-coated diamond particles to the tungsten material will improve its thermal performance.
引用
收藏
页码:153 / 165
页数:13
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