High-Throughput Exploration of Half-Heusler Phases for Thermoelectric Applications

被引:4
作者
Bilinska, Kaja [1 ]
Winiarski, Maciej J. [1 ]
机构
[1] Polish Acad Sci, Inst Low Temp & Struct Res, Okolna 2, PL-50370 Wroclaw, Poland
关键词
half-Heusler alloys; electronic structure; thermoelectric materials; INITIO MOLECULAR-DYNAMICS; TOTAL-ENERGY CALCULATIONS; THERMODYNAMIC PROPERTIES; HIGH-TEMPERATURE; 1ST PRINCIPLE; POWER-FACTORS; PERFORMANCE; COMPOUND; ZR; NI;
D O I
10.3390/cryst13091378
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
As a result of the high-throughput ab initiocalculations, the set of 34 stable and novel half-Heusler phases was revealed. The electronic structure and the elastic, transport, and thermoelectric properties of these systems were carefully investigated, providing some promising candidates for thermoelectric materials. The complementary nature of the research is enhanced by the deformation potential theory applied for the relaxation time of carriers (for power factor, PF) and the Slack formula for the lattice thermal conductivity (for figure of merit, ZT). Moreover, two exchange-correlation parametrizations were used (GGA and MBJGGA), and a complete investigation was provided for both p- and n-type carriers. The distribution of the maximum PF and ZT for optimal doping at 300 K in all systems was disclosed. Some chemical trends in electronic and transport properties were discussed. The results suggest TaFeAs, TaFeSb, VFeAs, and TiRuAs as potentially valuable thermoelectric materials. TaFeAs revealed the highest values of both PF and ZT at 300 K (PFp = 1.67 mW/K2m, ZTp = 0.024, PFn = 2.01 mW/K2m, and ZTp = 0.025). The findings presented in this work encourage further studies on the novel phases, TaFeAs in particular.
引用
收藏
页数:12
相关论文
共 50 条
  • [21] Transport properties of RuV-based half-Heusler semiconductors for thermoelectric applications: a computational study
    Enamullah
    Sharma, Sunil Kumar
    Ahmed, Sameh S.
    JOURNAL OF PHYSICS-CONDENSED MATTER, 2020, 32 (40)
  • [22] P-type dopability in Half-Heusler thermoelectric semiconductors
    Hu, Lirong
    Han, Shen
    Zhu, Tiejun
    Deng, Tianqi
    Fu, Chenguang
    NPJ COMPUTATIONAL MATERIALS, 2025, 11 (01)
  • [23] High-temperature thermoelectric properties of half-Heusler phases Er1-xHoxNiSb
    Ciesielski, K.
    Synoradzki, K.
    Wolanska, I.
    Stuglik, P.
    Kaczorowski, D.
    MATERIALS TODAY-PROCEEDINGS, 2019, 8 : 562 - 566
  • [24] High Temperature Thermoelectric Properties of Half-Heusler Compound PtYSb
    Li, Guanghe
    Kurosaki, Ken
    Ohishi, Yuji
    Muta, Hiroaki
    Yamanaka, Shinsuke
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2013, 52 (04)
  • [25] Intrinsic point defects in thermoelectric half-Heusler alloys
    Chai, Yaw Wang
    Yoshioka, Kentaro
    Kimura, Yoshisato
    SCRIPTA MATERIALIA, 2014, 83 : 13 - 16
  • [26] Synthesis and thermoelectric properties of half-Heusler alloy YNiBi
    Li, Shanming
    Zhao, Huaizhou
    Li, Dandan
    Jin, Shifeng
    Gu, Lin
    JOURNAL OF APPLIED PHYSICS, 2015, 117 (20)
  • [27] High Efficiency Half-Heusler Thermoelectric Materials for Energy Harvesting
    Zhu, Tiejun
    Fu, Chenguang
    Xie, Hanhui
    Liu, Yintu
    Zhao, Xinbing
    ADVANCED ENERGY MATERIALS, 2015, 5 (19)
  • [28] Impact of Ir doping on the thermoelectric transport properties of half-Heusler alloys
    Abdelkebir, B.
    Semari, F.
    Charifi, Z.
    Baaziz, H.
    Ghellab, T.
    Ugur, S.
    Ugur, G.
    Khenata, R.
    PHYSICA SCRIPTA, 2024, 99 (11)
  • [29] The role of interstitial Cu on thermoelectric properties of ZrNiSn half-Heusler compounds
    Yan, Ruijuan
    Shen, Chen
    Widenmeyer, Marc
    Luo, Ting
    Winkler, Robert
    Adabifiroozjaei, Esmaeil
    Xie, Ruiwen
    Yoon, Songhak
    Suard, Emmanuelle
    Molina-Luna, Leopoldo
    Zhang, Hongbin
    Xie, Wenjie
    Weidenkaff, Anke
    MATERIALS TODAY PHYSICS, 2023, 33
  • [30] Nanograined Half-Heusler Semiconductors as Advanced Thermoelectrics: An Ab Initio High-Throughput Statistical Study
    Carrete, Jesus
    Mingo, Natalio
    Wang, Shidong
    Curtarolo, Stefano
    ADVANCED FUNCTIONAL MATERIALS, 2014, 24 (47) : 7427 - 7432