On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules Under Power Cycling Conditions

被引：1

作者：

Chen, Yue ^{[1
]}

Mei, Yun-Hui ^{[2
]}

Ning, Puqi ^{[3
]}

Lu, Guo-Quan ^{[4
]}

机构：

[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China

[2] Tiangong Univ, Sch Elect Engn, Tianjin 300387, Peoples R China

[3] Chinese Acad Sci, Inst Elect Engn, Beijing 100190, Peoples R China

[4] Virginia Tech, Ctr Power Elect Syst, Bradley Dept Elect & Comp Engn, Blacksburg, VA 24061 USA

来源：

IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS | 2023年 / 11卷 / 04期

基金：

中国国家自然科学基金;

关键词：

Double-sided cooling (DSC); power cycling; temperature estimation; thermal resistance; on-site; RELIABILITY; IMPEDANCE; WIRE;

D O I：

10.1109/JESTPE.2023.3278453

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Double-sided cooling (DSC) power modules are increasingly used due to their superior cooling capability and low parasitic inductance. However, the DSC modules have multiple interconnections for heat dissipation, so it is challenging to accurately monitor the thermal resistance degradation of each interconnection under power cycling conditions. An estimation method considering the self-heating and thermal coupling effects of DSC power modules is proposed based on a traditional lumped resistor-capacitor (RC) thermal impedance network. The proposed method combining a recursive least squares (RLSs) algorithm with a thermal network model can well evaluate the thermal resistance of each interconnection and their variations on-site during power cycling tests. The lifetime of DSC power modules for power cycling tests could be overestimated if using the 20% increment in overall thermal resistance of DSC modules as a failure criterion.

引用

页码：4419 / 4429

页数：11

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