In situ observation of destabilization of a nanostructured Ag/Cu multilayer fabricated via multicomponent accumulative roll bonding

被引：3

作者：

Dong, H. ^{[1
,2
]}

Guo, Y. C. ^{[2
]}

Zhu, D. ^{[2
]}

Shan, G. B. ^{[1
]}

Yang, G. Y. ^{[1
]}

Chen, Y. Z. ^{[1
]}

机构：

[1] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China

[2] Xian Technol Univ, Sch Mat & Chem Engn, Xian 710021, Peoples R China

来源：

MATERIALS & DESIGN | 2023年 / 236卷

基金：

中国国家自然科学基金;

关键词：

Ag/Cu multilayer; Accumulative roll bonding; Nanostructure; Lamellar structure; THERMAL-STABILITY; NANOLAMELLAR COMPOSITES; INSTABILITY MECHANISMS; TEXTURE EVOLUTION; SOLIDIFICATION; MODEL; MICROSTRUCTURE; INTERFACE;

D O I：

10.1016/j.matdes.2023.112487

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Nanostructured metallic multilayered composites have many excellent properties due to their high-density heterophase interfaces, but they also pose challenges to the thermal stability of their multilayered structures. In this work, destabilization behavior of nanostructured Ag/Cu multilayer with an individual layer thickness of 40 nm prepared by multicomponent accumulative roll bonding is directly observed by transmission electron microscope. The results show that the destabilization of the nanostructured Ag/Cu multilayer originates from the interfacial instability perturbation driven by compositional gradient and capillary force. The subsequent destabilizing process is closely related to the cross-sectional ratio of the lamellar structure. When the thickness difference between adjacent lamellae is large, the lamellae with smaller thickness will follow a destabilizing sequence of perturbation -* necking -* pinching -* termination migration. While the thickness of adjacent lamellae is similar, the perturbed lamellae tend to form stable grooves during roughening.

引用

页数：7

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