Process Control Challenges and Solutions for Advanced Semiconductor Devices

被引：0
作者：
Jee, Yun Jung [1 ]
Han, Sang Hyun
Wolfling, Shay [2 ]
机构：
[1] Nova Measuring Instruments LTD, 93 Dongtandaero 23 gil, Hwasung Si, Gyeonggi Do, South Korea
[2] Nova LTD, 5 Fikes St,Weizmann Sci Pk, IL-76100 Rehovot, Israel
来源：
2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM | 2023年
关键词：
process control; lab-to-fab; materials characterization; hybrid metrology; machine learning;
D O I：
10.1109/EDTM55494.2023.10103045
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We report on the challenges of process control for advanced semiconductor devices and comprehensive solutions to overcome them. The challenges arise in the environment of 3D structures and process complexity where pitch decreases and aspect ratio increases at advanced technology nodes. In this work we will summarize how various strategies, including the Lab to Fab conversion of new source technology, are being implemented through several cases. We will also outline the need for further improvement.
引用
收藏
页数：3
相关论文
共 13 条
  • [1] Antonelli G.A., 2021, SPIE, V11611, DOI 10.1117/12.2583786
  • [2] Fan M., 2021, PROC 35 METROL INSP, V11611, p116110S, DOI [10.1117/12.2585217, DOI 10.1117/12.2585217]
  • [3] Ganesh V., 2022, PROC SPIE, V11325
  • [4] Krishtab M., 2020, PROC SPIE, V11325
  • [5] Levi S., 2018, Metrology, Inspection, and Process Control for Microlithography, VXXXII, P225, DOI DOI 10.1117/12.2297265
  • [6] Paul K., 2022, PROC SPIE PC12053
  • [7] Vertical Travelling Scatterometry for Metrology on Fully Integrated Devices
    Schmidt, D.
    Medikonda, M.
    Rizzolo, M.
    Silvestre, C.
    Frougier, J.
    Greene, A.
    Breton, M.
    Cepler, A.
    Ofele, J.
    Kaplan, I
    Koret, R.
    Turovets, I
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL XXXVI, 2022, 12053
  • [8] Line top loss and line top roughness characterizations of EUV resists
    Schmidt, D.
    Petrillo, K.
    Breton, M. A.
    Fullam, J.
    Hand, S.
    Osborne, J.
    Wang, W.
    Fey, D.
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXXIV, 2020, 11325
  • [9] Schmidt D., 2021, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, V1611, DOI [10.1117/12.2582364, DOI 10.1117/12.2582364]
  • [10] Schmidt D., 2021, P SPIE 11611 METROLO, V11611, DOI DOI 10.1117/12.2582181
12