Co effect on rapid solidification microstructure transition of highly undercooled copper alloys

被引：1

作者：

Xu, Xiaolong ^{[1
,4
]}

Wu, Qi ^{[1
]}

Hao, Yongchao ^{[1
]}

Wu, Li ^{[1
]}

Zhao, Yuhong ^{[1
,2
,4
]}

Hou, Hua ^{[1
,3
,4
]}

机构：

[1] North Univ China, Coll Mat Sci & Engn, Taiyuan 030051, Peoples R China

[2] Univ Sci & Technol Beijing, Beijing Adv Innovat Ctr Mat Genome Engn, Beijing 10083, Peoples R China

[3] Taiyuan Univ Sci & Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China

[4] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Shaanxi, Peoples R China

来源：

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | 2023年 / 25卷

关键词：

Undercooling; Microstructure; Grain refinement; Dendritic remelting; Recrystallization; Solidification rate; GRAIN-REFINEMENT; GROWTH VELOCITY; CRYSTAL-GROWTH; RECRYSTALLIZATION; MECHANISM; EVOLUTION; BEHAVIOR;

D O I：

10.1016/j.jmrt.2023.07.105

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The present work systematically studied nonequilibrium solidification microstructure and its morphology evolution with undercooling of Cu60Ni40 binary alloy and Cu60Ni35Co5 ternary alloy, and the characteristic undercooling degree of alloy evolution was deter-mined. Combining with BCT model, dendritic growth of undercooled Cu-Ni alloy was studied. On the basis of the above, a new ternary single-phase alloy was formed by adding minor Co element into Cu60Ni40 alloy. Subsequently, a comparative analysis was con-ducted on Cu60Ni40 and Cu60Ni35Co5 alloys, exploring the effect of Co element on the evolution of microstructure of deeply undercooled Cu-Ni alloys.& COPY; 2023 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

引用

页码：6924 / 6937

页数：14

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