High-power tests in Additive Manufacturing Ka-band feeds and feed components

被引:0
|
作者
Menargues, Esteban [1 ]
Sirci, Stefano [1 ]
Calleau, Antoine [1 ]
Dimitriades, Alexandre [1 ]
机构
[1] SWISSto12 SA, Renens, Switzerland
来源
2023 INTERNATIONAL CONFERENCE ON ELECTROMAGNETICS IN ADVANCED APPLICATIONS, ICEAA | 2023年
关键词
3D printing; Additive Manufacturing; Multipactor; PIM; feed chains; high-power;
D O I
10.1109/ICEAA57318.2023.10297704
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This conference papers reports for the first time high-power RF experiments (multipactor and PIM) in 3D printed and plated waveguide components fabricated using the SWISSto12 3D printing and plating process. The components subjected to test are two very common space-borne Ka-band payload components: a harmonic filter adapted to 3D printing for output stages, and a TX/RX complex circularly-polarized feed chain. The article describes the two high-power test campaigns and demonstrates that RF products fabricated with metal 3D printing do not show high-power issues.
引用
收藏
页码:647 / 651
页数:5
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