Thin film electronic devices marry lab-on-chip applications

被引：0
|
作者：
Caputo, Domenico [1 ]
机构：
[1] Univ Roma La Sapienza, Rome, Italy
来源：
2023 9TH INTERNATIONAL WORKSHOP ON ADVANCES IN SENSORS AND INTERFACES, IWASI | 2023年
关键词：
D O I：
10.1109/IWASI58316.2023.10164460
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：312 / 312
页数：1
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