Automatic optimal design of field plate for silicon on insulator lateral double-diffused metal oxide semiconductor using simulated annealing algorithm

Field plate (FP) technology has been widely used due to its simple structure and process compatibility. Through introducing the interface charge to suppress the electric field peak at the junction region, the breakdown performance can be improved. However, designing an appropriate FP for semiconductor power devices is challenging and time-consuming. In this paper, the authors propose a fully automated FP optimal design method based on simulated annealing algorithm (SA) for silicon on insulator lateral double-diffused metal oxide semiconductor. By using an automatic iterative process to obtain the minimum value of the objective function, the parameters related to the FP can be effectively provided. Numerical results show that when the breakdown occurs at the N+N or PN junction, the breakdown voltage can be optimized by an average of 18.6% and 45.5%, respectively. Moreover, compared with the existing methods, the proposed approach is highly efficient with a runtime that does not exceed 12 s. The authors believe that this method can greatly accelerate the power device design process. In this paper, an automatic optimal design method for field plate (FP) in silicon on insulator lateral double-diffused metal oxide semiconductor using simulated annealing algorithm is proposed. For a given device structure, the framework can automatically design the FP geometry parameters within the definite range that maximizes the device breakdown voltage without human intervention. Meanwhile, the optimization process can be finished in a few seconds. image