Microstructure and Shear properties of Sn-xZn Transient Liquid Phase Bonding in 3D-Chip Stacking Packaging

被引：2
|
作者：
Liu, Zheng [1 ]
Wang, Xiang Yu [3 ]
Yang, Li [1 ,2 ]
Sun, Lian Bei [4 ]
Jiao, Xi Xuan [5 ]
Gao, Hui Ming [6 ]
Zhang, Zhi Tao [6 ]
Zhang, Yao Cheng [7 ]
机构：
[1] Guilin Univ Aerosp Technol, Sch Mech Engn, Guilin 541004, Guangxi, Peoples R China
[2] Guangdong Univ Technol, Sch Adv Mfg, Guangzhou 510006, Guangdong, Peoples R China
[3] Guilin Univ Elect Technol, Sch Mech Engn, Guilin 514004, Guangxi, Peoples R China
[4] Changzhou Univ, Sch Mech Engn, Changzhou 213164, Jiangsu, Peoples R China
[5] Guilin Univ Technol, Sch Mech Engn, Guilin 541004, Guangxi, Peoples R China
[6] Natl Dies & Molds Qual Supervis Test Ctr, Xuzhou 215300, Jiangsu, Peoples R China
[7] Changshu Inst Technol, Sch Automat Engn, Suzhou 215500, Jiangsu, Peoples R China
来源：
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS | 2023年 / 76卷 / 10期
基金：
中国国家自然科学基金;
关键词：
Composite solder; Transient liquid phase connection; Microstructure; Shear properties;
D O I：
10.1007/s12666-022-02866-1
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The microstructure and shear property of Cu/Sn-xZn/Cu (x = 0, 2, 5, 9, 30, 70 wt.%) composite solder joints fabricated by transient liquid phase (TLP) bonding were investigated. The results showed that the appropriate amount of Zn particles inhibited Cu-6(Sn, Zn)(5) phase formation at the Cu/solder interface. The Zn particles can improve the interface IMC morphology of composite solder joints, the interface IMC thickness of Cu/Sn-30Zn/Cu solder joint is only 3.89 mu m, and the excessive (30-70 wt.%) Zn particles are harmful to the composite solder joints. Doping 2-9 wt.% Zn particles can improve the shear strength. The maximum shear strength value of the Cu/Sn-9Zn/Cu composite solder joint reaches 14.18 MPa. The fracture mechanism is mainly ductile brittle mixed fracture, which occurs near the Interface reaction zone.
引用
收藏
页码：2757 / 2763
页数：7
相关论文
共 45 条
  • [21] Growth kinetics and microstructure evolution of network-like Cu3Sn during thermal aging in Ni/Sn-3.5Ag/Cu transient liquid-phase bonding
    Chen, Zi-Xu
    Wu, Zih-You
    Lin, Ta-Wei
    Chang, Shou-Yi
    Duh, Jenq-Gong
    MATERIALS LETTERS, 2024, 377
  • [22] Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu-SnAgCu Molded Sheets By High-Pressure Powder Compression
    Sakamoto, Ichizo
    Jeong, Doojin
    Tatsumi, Hiroaki
    Nishikawa, Hiroshi
    JOURNAL OF ELECTRONIC MATERIALS, 2025, 54 (01) : 773 - 783
  • [23] Investigation of interfacial reaction and shear behavior of Cu-Sn TLP bonding joints bearing Nd particles for 3D packaging
    Xu, Qiman
    Chen, Baishan
    Zhou, Jian
    Xue, Feng
    Chen, Qin
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [24] Interfacial reaction, shear behavior and microhardness of Cu-Sn TLP bonding joints bearing CuZnAl powder for 3D packaging
    Sun, Lei
    Zhang, Liang
    Zhang, Yi
    Chen, Ming-he
    Chen, Cong-ping
    JOURNAL OF MANUFACTURING PROCESSES, 2021, 68 : 1672 - 1682
  • [25] Microstructure and mechanical properties of transient liquid phase bonding Ti3SiC2 ceramic to SUS430 steel using an Al interlayer
    Zhao, Jing-xiang
    Li, Xi-chao
    Shi, Jing
    Cheng, Qiang
    Xu, Bin
    Sun, Ming-yue
    Zheng, Li-li
    JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2024, 31 (10) : 2475 - 2488
  • [26] Microstructure and mechanical properties of transient liquid phase (TLP)-bonded Ni3Al intermetallic compounds
    Samani, M. Soltani
    Bahrami, A.
    Karimzadeh, F.
    MATERIALS TODAY COMMUNICATIONS, 2019, 21
  • [27] The Effect of Bonding Time and Temperature on Microstructure and Mechanical Properties of SS316L/WC-Co Dissimilar Joint Produced by Transient Liquid Phase Bonding
    Heidari-Dehkordi, Behnam
    Rafiei, Mahdi
    Omidi, Mahdi
    Abbasi-Baharanchi, Mohsen
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2024,
  • [28] Transient liquid phase (TLP) bonding of Ti2AlNb alloy using Ti/Ni interlayer: Microstructure characterization and mechanical properties
    Cai, X. Q.
    Wang, Y.
    Yang, Z. W.
    Wang, D. P.
    Liu, Y. C.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 679 : 9 - 17
  • [29] Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering
    Liu, J. H.
    Zhao, H. Y.
    Li, Z. L.
    Song, X. G.
    Dong, H. J.
    Zhao, Y. X.
    Feng, J. C.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 692 : 552 - 557
  • [30] Processing of IN718/Ti-6Al-4V bimetallic joint using transient liquid phase bonding: effect of bonding temperature on the microstructure and mechanical properties
    Binesh, B.
    Aghaie-Khafri, M.
    Fayegh, A.
    PHILOSOPHICAL MAGAZINE, 2022, 102 (09) : 745 - 772
12345