Microstructure and Shear properties of Sn-xZn Transient Liquid Phase Bonding in 3D-Chip Stacking Packaging

被引：2
|
作者：
Liu, Zheng [1 ]
Wang, Xiang Yu [3 ]
Yang, Li [1 ,2 ]
Sun, Lian Bei [4 ]
Jiao, Xi Xuan [5 ]
Gao, Hui Ming [6 ]
Zhang, Zhi Tao [6 ]
Zhang, Yao Cheng [7 ]
机构：
[1] Guilin Univ Aerosp Technol, Sch Mech Engn, Guilin 541004, Guangxi, Peoples R China
[2] Guangdong Univ Technol, Sch Adv Mfg, Guangzhou 510006, Guangdong, Peoples R China
[3] Guilin Univ Elect Technol, Sch Mech Engn, Guilin 514004, Guangxi, Peoples R China
[4] Changzhou Univ, Sch Mech Engn, Changzhou 213164, Jiangsu, Peoples R China
[5] Guilin Univ Technol, Sch Mech Engn, Guilin 541004, Guangxi, Peoples R China
[6] Natl Dies & Molds Qual Supervis Test Ctr, Xuzhou 215300, Jiangsu, Peoples R China
[7] Changshu Inst Technol, Sch Automat Engn, Suzhou 215500, Jiangsu, Peoples R China
来源：
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS | 2023年 / 76卷 / 10期
基金：
中国国家自然科学基金;
关键词：
Composite solder; Transient liquid phase connection; Microstructure; Shear properties;
D O I：
10.1007/s12666-022-02866-1
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The microstructure and shear property of Cu/Sn-xZn/Cu (x = 0, 2, 5, 9, 30, 70 wt.%) composite solder joints fabricated by transient liquid phase (TLP) bonding were investigated. The results showed that the appropriate amount of Zn particles inhibited Cu-6(Sn, Zn)(5) phase formation at the Cu/solder interface. The Zn particles can improve the interface IMC morphology of composite solder joints, the interface IMC thickness of Cu/Sn-30Zn/Cu solder joint is only 3.89 mu m, and the excessive (30-70 wt.%) Zn particles are harmful to the composite solder joints. Doping 2-9 wt.% Zn particles can improve the shear strength. The maximum shear strength value of the Cu/Sn-9Zn/Cu composite solder joint reaches 14.18 MPa. The fracture mechanism is mainly ductile brittle mixed fracture, which occurs near the Interface reaction zone.
引用
收藏
页码：2757 / 2763
页数：7
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