Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0Ag-0.5Cu solder paste on InGaN LED chip/ENIG joints

被引：6
作者：
Rajendran, Sri Harini [1 ]
Seo, Seong Min [1 ]
Jung, Jae Pil [1 ]
机构：
[1] Univ Seoul, Dept Mat Sci & Engn, 163 Seoulsiripdae Ro, Seoul 02504, South Korea
来源：
MATERIALS TODAY COMMUNICATIONS | 2023年 / 35卷
关键词：
Sn3; 0Ag0; 5Cu (SAC 305); ZnO nanowires; Spreading ratio; Shear strength; Weibull analysis; TIO2 NANOPARTICLES ADDITION; NANOCOMPOSITE SAC SOLDERS; COMPOSITE SOLDER; SHEAR-STRENGTH; MECHANICAL-PROPERTIES; INTERMETALLIC GROWTH; TENSILE PROPERTIES; CARBON NANOTUBES; CREEP-PROPERTIES; CU;
D O I：
10.1016/j.mtcomm.2023.105795
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Nanocomposite solder has been recognized as an excellent strategy to improve the reliability of solder joints. This study attempts to find the effects of ZnO nanoparticles (NP) and nanowires (NW), on the LED/Sn3.0Ag0.5Cu joint reliability. Varying amounts of ZnO NP and NW are dispersed into solder using a high-speed centrifugal paste mixer and LED/solder joints were assembled via paste printing and reflow technique. Until 0.2 wt %, adding NP and NW improved the spreading ratio of SAC 305 paste by 8.7 % and 11.1 %. However, due to ceramic/metal surface instability, higher addition declined the spreading ratio. Both NP and NW suppressed the (Cu, Ni)6Sn5 intermetallic compound (IMC) formed at the LED/solder joint. Dispersion strengthening provided by NP and NW improved the joint shear strength by 28.2 % and 31.1 %, respectively. The Weibull modulus and 75 % survival probability improved consistently with increasing ZnO NW addition, displaying homogeneity in shear strength and reliable LED/solder joints.
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页数：16
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