Total-Ionizing-Dose Effects at Ultrahigh Doses in AlGaN/GaN HEMTs

被引:6
作者
Bonaldo, Stefano [1 ]
Zhang, En Xia [2 ]
Mattiazzo, Serena [3 ,4 ]
Paccagnella, Alessandro [1 ]
Gerardin, Simone [1 ]
Schrimpf, Ronald D. [2 ]
Fleetwood, Daniel M. [2 ]
机构
[1] Univ Padua, Dept Informat Engn, I-38134 Padua, Italy
[2] Vanderbilt Univ, Dept Elect & Comp Engn, Nashville, TN 37235 USA
[3] Univ Padua, Dept Phys & Astron, I-38134 Padua, Italy
[4] INFN Sez Padova, I-38134 Padua, Italy
关键词
MODFETs; HEMTs; Radiation effects; Degradation; Wide band gap semiconductors; Aluminum gallium nitride; Annealing; AlGaN high-electron-mobility transistors (HEMTs); bias condition; charge trapping; dc; low-frequency noise; total ionizing dose (TID); LOW-FREQUENCY NOISE; 1/F NOISE; MOS; DEFECTS; DEGRADATION; VOLTAGE; STRESS; TRAPS;
D O I
10.1109/TNS.2023.3237179
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Total-ionizing-dose (TID) effects in AlGaN/GaN high-electron-mobility transistors (HEMTs) are evaluated by dc and low-frequency noise measurements. Devices with and without passivation layers are irradiated with 10-keV X-rays up to 100 Mrad(SiO2) under different bias conditions. Irradiated devices show significant electrical shifts in threshold voltage and transconductance. At doses <10 Mrad(SiO2), the TID-induced effects are related to the passivation of preexisting acceptor-like defects via hole capture, which induces negative threshold voltage shifts and improvement of transconductance. At doses >10 Mrad(SiO2), dehydrogenation of defects and impurity complexes leads to the creation of acceptor-like defects, which degrade the transconductance, shift positively the threshold voltage, and increase the low-frequency noise. Effects are enhanced in unpassivated devices and when the gate is biased at high voltage.
引用
收藏
页码:2042 / 2050
页数:9
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