Addressing Power Decoupling in High-Performance, High-Frequency Applications Using E-CAP

被引：0

作者：

Krishna, Mukund ^{[1
,2
,3
]}

Vassalli, Luca ^{[1
]}

机构：

[1] Empower Semicond, San Jose, CA 95134 USA

[2] Bharathidasan Univ, Elect & Elect Engn, Tiruchirappalli, India

[3] Univ Southern Calif Los Angeles, Elect Engn, Los Angeles, CA 90007 USA

来源：

IEEE POWER ELECTRONICS MAGAZINE | 2023年 / 10卷 / 03期

关键词：

Power system measurements; Program processors; Power demand; Density measurement; Ceramic capacitors; Nonhomogeneous media; Power electronics;

D O I：

10.1109/MPEL.2023.3301415

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

As one of the most basic and fundamental components in electronics, capacitors are used in large numbers across a variety of designs. A key requirement for applications such as mobile phones, IoT devices, and high-performance compute applications is to effectively address last mile power delivery challenges, such as high-frequency power demands for the high-performance processors that they are inevitably based on. While traditional multilayer ceramic capacitors (MLCCs) have fulfilled the requirements thus far, stricter constraints on power density are challenging the continued usage of the existing model.

引用

页码：29 / 35

页数：7