A Momentum Contrastive Learning Framework for Low-Data Wafer Defect Classification in Semiconductor Manufacturing

被引:4
作者
Wang, Yi [1 ]
Ni, Dong [1 ]
Huang, Zhenyu [2 ]
机构
[1] Zhejiang Univ, Coll Control Sci & Engn, Hangzhou 310027, Peoples R China
[2] Intel Corp, Dalian 116630, Peoples R China
来源
APPLIED SCIENCES-BASEL | 2023年 / 13卷 / 10期
基金
美国国家科学基金会;
关键词
contrastive learning; low data; self-supervised learning; wafer bin map; defect classification; semiconductor manufacturing; NEURAL-NETWORK; BIN MAP; PATTERNS; IDENTIFICATION;
D O I
10.3390/app13105894
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Wafer bin maps (WBMs) are essential test data in semiconductor manufacturing. WBM defect classification can provide critical information for the improvement of manufacturing processes and yield. Although deep-learning-based automatic defect classification models have demonstrated promising results in recent years, they require a substantial amount of labeled data for training, and manual labeling is time-consuming. Such limitations impede the practical application of existing algorithms. This study introduces a low-data defect classification algorithm based on contrastive learning. By employing momentum contrastive learning, the network extracts effective representations from large-scale unlabeled WBMs. Subsequently, a prototypical network is utilized for fine-tuning with only a minimal amount of labeled data to achieve low-data classification. Experimental results reveal that the momentum contrastive learning method improves the defect classification performance by learning feature representation from large-scale unlabeled data. The proposed method attains satisfactory classification accuracy using a limited amount of labeled data and surpasses other comparative methods in performance. This approach allows for the exploitation of information derived from large-scale unlabeled data, significantly reducing the reliance on labeled data.
引用
收藏
页数:14
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