Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing

被引:12
作者
Wu, Bin [1 ]
Zhang, Zhenyu [1 ]
Feng, Junyuan [1 ]
Meng, Fanning [2 ]
Wan, Shengzuo [1 ]
Zhuang, Xuye [3 ]
Li, Li [3 ]
Liu, Haoran [4 ,5 ]
Zhang, Fuxu [1 ]
机构
[1] Dalian Univ Technol, Key Lab Precis & Non Tradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China
[2] Hangzhou Dianzi Univ, Sch Mech Engn, Hangzhou 310018, Peoples R China
[3] Shandong Univ Technol, Sch Mech Engn, Zibo 255000, Peoples R China
[4] Yantai Res Inst, Yantai 264006, Peoples R China
[5] Harbin Engn Univ, Grad Sch, Yantai 264006, Peoples R China
基金
中国国家自然科学基金;
关键词
NdFeB; diamond wire sawing; saw marks; surface quality; swing; vibration; FE-B; VIBRATION ANALYSIS; PERMANENT-MAGNETS; MICROSTRUCTURE; ROUGHNESS;
D O I
10.3390/ma16041521
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Diamond wire sawing is widely used in processing NdFeB rare earth permanent magnets. However, it induces periodic saw marks and fracture chipping pits, which severely affect the flatness and surface quality of the products. In this study, the lateral motion of the diamond wire was monitored to determine the surface formation mechanism. Then, a white light interferometer and an SEM were used to observe the sawed surface profile. Finally, the surface quality was quantitatively studied by identifying the area rate of fracture chipping pits with an image recognition MATLAB script. According to the observation results, the calculation formula of PV which is related to the process parameters was deduced. Additionally, by combining the fracture rate and wire vibration, a novel method was proposed to investigate the optimal process parameters. It can be found that the surface quality sawed at P = 0.21 MPa, v(f) = 0.2 mm/min, and v(s) = 1.8 m/s remains better than when sawed at P = 0.15 MPa, v(f) = 0.1 mm/min, and v(s) = 1.8 m/s, which means the sawing efficiency can be doubled under such circumstances, i.e., when the surface quality remains the same.
引用
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页数:21
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