Interface enhancing strategy for low-temperature bonding of Ag-based nanoalloy

被引：1

作者：

Jia, Qiang ^{[1
,2
]}

Deng, Zhongyang ^{[2
]}

Liu, Lei ^{[2
]}

Zhang, Hongqiang ^{[3
]}

Wang, Wengan ^{[2
]}

Ma, Limin ^{[1
]}

Guo, Fu ^{[1
,4
]}

Zou, Guisheng ^{[1
,2
]}

机构：

[1] Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China

[2] Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China

[3] Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China

[4] Beijing Union Univ, Coll Robot, Beijing 100101, Peoples R China

来源：

MATERIALS LETTERS | 2023年 / 339卷

基金：

中国国家自然科学基金;

关键词：

Laser deposition; Nanoalloy; Interface structure; Sintering; Electronic packaging; DIE-ATTACH;

D O I：

10.1016/j.matlet.2023.134050

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Bonding interface quality is crucial for power electronic packaging, while the alloyed Ag nanoparticle sintered joint has lower crack resistance at the interface. In this work, a sandwich structure nanoparticle film consisting of an Ag transition layer, nanoalloy layer, and Ag transition layer was developed for interface-enhanced lowtemperature bonding. The optimized sandwich structure increased the shear strength of Ag-based nanoalloy sintered joints, reaching 5.6 times for Ag10Cu and 2.0 times for Ag10Pd, respectively. The low-temperature spreadability of the Ag transition layer provided a micro-nano structure and further driving force for nanoalloy sintering on the substrate. Both experimental and molecular dynamics simulation results revealed that these nanoalloy particles spread easier and realized a higher effective bonding area. This interface-enhancing strategy enables the Ag-based nanoalloy a high-reliability die-attach material with low-temperature bondability.

引用

页数：4

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