Interface enhancing strategy for low-temperature bonding of Ag-based nanoalloy

被引：1
作者：
Jia, Qiang [1 ,2 ]
Deng, Zhongyang [2 ]
Liu, Lei [2 ]
Zhang, Hongqiang [3 ]
Wang, Wengan [2 ]
Ma, Limin [1 ]
Guo, Fu [1 ,4 ]
Zou, Guisheng [1 ,2 ]
机构：
[1] Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
[2] Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
[3] Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China
[4] Beijing Union Univ, Coll Robot, Beijing 100101, Peoples R China
来源：
MATERIALS LETTERS | 2023年 / 339卷
基金：
中国国家自然科学基金;
关键词：
Laser deposition; Nanoalloy; Interface structure; Sintering; Electronic packaging; DIE-ATTACH;
D O I：
10.1016/j.matlet.2023.134050
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Bonding interface quality is crucial for power electronic packaging, while the alloyed Ag nanoparticle sintered joint has lower crack resistance at the interface. In this work, a sandwich structure nanoparticle film consisting of an Ag transition layer, nanoalloy layer, and Ag transition layer was developed for interface-enhanced lowtemperature bonding. The optimized sandwich structure increased the shear strength of Ag-based nanoalloy sintered joints, reaching 5.6 times for Ag10Cu and 2.0 times for Ag10Pd, respectively. The low-temperature spreadability of the Ag transition layer provided a micro-nano structure and further driving force for nanoalloy sintering on the substrate. Both experimental and molecular dynamics simulation results revealed that these nanoalloy particles spread easier and realized a higher effective bonding area. This interface-enhancing strategy enables the Ag-based nanoalloy a high-reliability die-attach material with low-temperature bondability.
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页数：4
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