Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

被引:7
作者
Boruah, Dibakor [1 ]
Dewagtere, Nele [1 ]
Ahmad, Bilal [2 ]
Nunes, Rafael [3 ]
Tacq, Jeroen [4 ]
Zhang, Xiang [2 ]
Guo, Hua [2 ]
Verlinde, Wim [3 ]
De Waele, Wim [1 ]
机构
[1] Univ Ghent, Fac Engn & Architecture, Dept Electromech Syst & Met Engn, B-9052 Ghent, Belgium
[2] Coventry Univ, Fac Engn Environm & Comp, Coventry CV15FB, England
[3] Belgian Welding Inst, B-9052 Ghent, Belgium
[4] Sirris, B-9052 Ghent, Belgium
关键词
additive manufacturing; contour method; digital image correlation; residual stresses; wire plus arc additive manufacturing; X-ray diffraction; MICROSTRUCTURE; DISTORTION;
D O I
10.3390/ma16041702
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.
引用
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页数:19
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