High Thermally Stable Anthracene-Based Polyimides with Low Dielectric Constants and Dissipation Factors

被引:13
作者
Lee, Yueh-Hsing [1 ,2 ]
Lin, Jin-Wei [1 ,2 ]
Huang, Yu-Chen [1 ,2 ]
Huang, Yung-Jen [1 ,2 ]
Busireddy, Manohar Reddy [1 ,2 ]
Chen, Jiun-Tai [1 ,2 ]
Hsu, Chain-Shu [1 ,2 ]
机构
[1] Natl Yang Ming Chiao Tung Univ, Dept Appl Chem, Hsinchu 300093, Taiwan
[2] Natl Yang Ming Chiao Tung Univ, Ctr Emergent Funct Matter Sci, Hsinchu 300093, Taiwan
关键词
anthracene; polyimides; high thermalstability; low dielectric constant; low dissipationfactor; coefficient of thermal expansion; MOLECULAR-STRUCTURE; FREE-VOLUME; POLYMERS; DESIGN; FILMS;
D O I
10.1021/acsapm.3c02003
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
At present, high-performance polymers with low dielectric constants (D-k) and low dissipation factors (D-f) have gained much attention with the rapid evolution of microelectronic and 5G communication technologies. Due to their excellent thermal stabilities, heat resistances, mechanical strengths, and dielectric properties, polyimides (PIs) have attracted a lot of attention. Herein, a series of anthracene (An)-based PIs are synthesized from an ester-functionalized anthracene diamine (An-NH2) monomer and four kinds of commercial dianhydrides such as keto (3,3 ',4,4 '-benzophenonetetracarboxylic dianhydride (BTDA)), sulfone (3,3 ',4,4 '-diphenylsulfone tetracarboxylic dianhydride (DSDA)), fluoro (4,4 '-(hexafluoroisopropylidene)diphthalic anhydride (6FDA)), and ether (4,4 '-(4,4 '-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) and 4,4-oxydiphthalic anhydride (ODPA)) functional groups by a two-step process, i.e., the chemical polyaddition followed by thermal imidization. The resulting An-NH2/BTDA, An-NH2/DSDA, An-NH2/6FDA, An-NH2/BPADA, and An-NH2/ODPA PIs are denoted as AnBT-PI, AnDS-PI, An6F-PI, AnBPA-PI, and AnOD-PI, respectively. As a result, all An-based PI films display excellent thermal properties, with thermal decomposition temperatures of 450-530 degrees C (T-d5% weight loss) and glass transition temperatures (T-g) of 270-410 degrees C. In addition, these PI films exhibit decent optical transparency, flexibility, coefficient of thermal expansion (CTE), and mechanical properties. Remarkably, all An-based PI films show excellent dielectric properties with a low D-k of 2.540-3.388 and a D-f of 0.0059-0.0240 at high frequency (10 GHz). In particular, the An-based PI films with ether linkages (AnOD-PI and AnBPA-PI) and a high fluorine content (An6F-PI) show low D-k and D-f values compared with those with keto (AnBT-PI) and sulfone (AnDS-PI) linkages. These results indicate that the An-based PIs are promising candidates for achieving low D-k and D-f values at higher frequencies. Overall, we believe this study will provide useful guidelines for the further structural development of An-based PIs with low D-k and D-f.
引用
收藏
页码:10196 / 10204
页数:9
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